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Article: Recent Developments of Planar Printed Circuit Board (PCB) Transformer Technology

TitleRecent Developments of Planar Printed Circuit Board (PCB) Transformer Technology
Authors
Hui, RSY
KeywordsPlanar Magentics
Planar Printed-Circuit-Board Transformers
Power Electronics
Issue Date2003
PublisherHong Kong Institution of Engineers. The Journal's web site is located at http://www.hkie.org.hk/html/publications/transactions/index.asp
Citation
Transactions Hong Kong Institution Of Engineers, 2003, v. 10 n. 4, p. 35-41 How to Cite?
AbstractRapid developments of planar magnetics in recent years have prompted new applications of planar transformers in electronic industry. The low-profile features of planar magentics make them attractive in many electronic systems that have stringent thickness requirements. In this article, some recent progress of planar PCB transformers and their applications are described. Comparisons of conventional and planar transformers are reviewed. New trend of integrated electronic packaging in power electronic systems is briefly discussed.
Persistent Identifierhttp://hdl.handle.net/10722/155250
ISSN
1023-697X
2023 SCImago Journal Rankings: 0.167
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorHui, RSYen_US
dc.date.accessioned2012-08-08T08:32:32Z-
dc.date.available2012-08-08T08:32:32Z-
dc.date.issued2003en_US
dc.identifier.citationTransactions Hong Kong Institution Of Engineers, 2003, v. 10 n. 4, p. 35-41en_US
dc.identifier.issn1023-697Xen_US
dc.identifier.urihttp://hdl.handle.net/10722/155250-
dc.description.abstractRapid developments of planar magnetics in recent years have prompted new applications of planar transformers in electronic industry. The low-profile features of planar magentics make them attractive in many electronic systems that have stringent thickness requirements. In this article, some recent progress of planar PCB transformers and their applications are described. Comparisons of conventional and planar transformers are reviewed. New trend of integrated electronic packaging in power electronic systems is briefly discussed.en_US
dc.languageengen_US
dc.publisherHong Kong Institution of Engineers. The Journal's web site is located at http://www.hkie.org.hk/html/publications/transactions/index.aspen_US
dc.relation.ispartofTransactions Hong Kong Institution of Engineersen_US
dc.subjectPlanar Magenticsen_US
dc.subjectPlanar Printed-Circuit-Board Transformersen_US
dc.subjectPower Electronicsen_US
dc.titleRecent Developments of Planar Printed Circuit Board (PCB) Transformer Technologyen_US
dc.typeArticleen_US
dc.identifier.emailHui, RSY:ronhui@eee.hku.hken_US
dc.identifier.authorityHui, RSY=rp01510en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-1242276332en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-1242276332&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume10en_US
dc.identifier.issue4en_US
dc.identifier.spage35en_US
dc.identifier.epage41en_US
dc.publisher.placeHong Kongen_US
dc.identifier.scopusauthoridHui, RSY=7202831744en_US
dc.identifier.issnl1023-697X-

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