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Article: Factors contributing to the incompatibility between simplified-step adhesives and chemically-cured or dual-cured composites. Part I. Single-step self-etching adhesive

TitleFactors contributing to the incompatibility between simplified-step adhesives and chemically-cured or dual-cured composites. Part I. Single-step self-etching adhesive
Authors
Issue Date2003
PublisherQuintessence Publishing Co Ltd. The Journal's web site is located at http://www.quintessencepublishing.co.uk/catalog/product_info.php?cPath=3&products_id=243
Citation
Journal of Adhesive Dentistry, 2003, v. 5 n. 1, p. 27-40 How to Cite?
AbstractPurpose: To determine if adverse chemical interaction and adhesive permeability are both responsible for the incompatibility between a single-step, self-etching adhesive and chemically-cured or dual-cured composites. Materials and Methods: Bonding was performed with Xeno CF Bond (Dentsply-Sankin), on either hydrated (H) or dehydrated (DH) human dentin. For microtensile bond strength evaluation, a dual-cured hybrid composite (Bis-Core) was activated using: (1) the light-cured (L) mode (base syringe only), (2) delayed light activation (DL) (base syringe left on top of cured adhesive in the dark for 20 min before activation), and 3) the chemically-cured (C) mode (base and catalyst syringes in the dark). A chemical co-initiator (B; BondLink) was also applied to the cured adhesive before coupling with the composite in chemically-cured mode. This resulted in seven experimental groups: (1) L-H (control); (2) DL-H; (3) DL-DH; (4) C-H; (5) C-DH; (6) C-B-H; and (7) C-B-DH. For transmission electron microscopy, the dual-cured composite in the seven groups was replaced with a light-cured microfilled composite (Metafil CX) and an experimental chemically-cured microfilled composite of the same composition. Specimens were immersed in ammoniacal silver nitrate for 24 h. After reduction of the diamine silver ions to silver, undemineralized and unstained sections were examined for nanoleakage within the resin-dentin interfaces of the seven groups. Results: For the light-cured modes, bond strengths fell substantially in DL-H but not in DL-DH. For the chemically-cured modes, bond strengths were lowest in C-H and only increased slightly in C-DH. The use of a chemical co-initiator with the adhesive further improved the bond strength in C-B-H. Only C-B-DH was not significantly different from the control light-cured mode L-H. Two abnormal modes of silver deposition were observed in resin-dentin interfaces. A continuous layer of silver was observed when the chemically-cured composite was applied to the cured adhesive in the absence of the chemical co-initiator (C-H; C-DH). Silver-impregnated water blisters were identified when the chemically-cured composite was coupled to bonded hydrated dentin (C-H; C-B-H). Similar water blisters were seen in DL-H in which adverse chemical interaction should not occur. Conclusion: Adverse chemical interaction between catalytic components of chemically-cured composite and the tested single-step, self-etching adhesive was the major cause of reductions in bond strength, while adhesive permeability was a minor cause of bond strength reduction. The combination of these two factors accounts for the substantial reduction in bond strength when chemically-cured or dual-cured composites were coupled to bonded hydrated dentin.
Persistent Identifierhttp://hdl.handle.net/10722/154248
ISSN
2015 Impact Factor: 1.594
2015 SCImago Journal Rankings: 0.486
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorTay, FRCMen_US
dc.contributor.authorPashley, DHen_US
dc.contributor.authorYiu, CKYen_US
dc.contributor.authorSanares, AMEen_US
dc.contributor.authorWei, SHYen_US
dc.date.accessioned2012-08-08T08:24:11Z-
dc.date.available2012-08-08T08:24:11Z-
dc.date.issued2003en_US
dc.identifier.citationJournal of Adhesive Dentistry, 2003, v. 5 n. 1, p. 27-40en_US
dc.identifier.issn1461-5185en_US
dc.identifier.urihttp://hdl.handle.net/10722/154248-
dc.description.abstractPurpose: To determine if adverse chemical interaction and adhesive permeability are both responsible for the incompatibility between a single-step, self-etching adhesive and chemically-cured or dual-cured composites. Materials and Methods: Bonding was performed with Xeno CF Bond (Dentsply-Sankin), on either hydrated (H) or dehydrated (DH) human dentin. For microtensile bond strength evaluation, a dual-cured hybrid composite (Bis-Core) was activated using: (1) the light-cured (L) mode (base syringe only), (2) delayed light activation (DL) (base syringe left on top of cured adhesive in the dark for 20 min before activation), and 3) the chemically-cured (C) mode (base and catalyst syringes in the dark). A chemical co-initiator (B; BondLink) was also applied to the cured adhesive before coupling with the composite in chemically-cured mode. This resulted in seven experimental groups: (1) L-H (control); (2) DL-H; (3) DL-DH; (4) C-H; (5) C-DH; (6) C-B-H; and (7) C-B-DH. For transmission electron microscopy, the dual-cured composite in the seven groups was replaced with a light-cured microfilled composite (Metafil CX) and an experimental chemically-cured microfilled composite of the same composition. Specimens were immersed in ammoniacal silver nitrate for 24 h. After reduction of the diamine silver ions to silver, undemineralized and unstained sections were examined for nanoleakage within the resin-dentin interfaces of the seven groups. Results: For the light-cured modes, bond strengths fell substantially in DL-H but not in DL-DH. For the chemically-cured modes, bond strengths were lowest in C-H and only increased slightly in C-DH. The use of a chemical co-initiator with the adhesive further improved the bond strength in C-B-H. Only C-B-DH was not significantly different from the control light-cured mode L-H. Two abnormal modes of silver deposition were observed in resin-dentin interfaces. A continuous layer of silver was observed when the chemically-cured composite was applied to the cured adhesive in the absence of the chemical co-initiator (C-H; C-DH). Silver-impregnated water blisters were identified when the chemically-cured composite was coupled to bonded hydrated dentin (C-H; C-B-H). Similar water blisters were seen in DL-H in which adverse chemical interaction should not occur. Conclusion: Adverse chemical interaction between catalytic components of chemically-cured composite and the tested single-step, self-etching adhesive was the major cause of reductions in bond strength, while adhesive permeability was a minor cause of bond strength reduction. The combination of these two factors accounts for the substantial reduction in bond strength when chemically-cured or dual-cured composites were coupled to bonded hydrated dentin.en_US
dc.languageengen_US
dc.publisherQuintessence Publishing Co Ltd. The Journal's web site is located at http://www.quintessencepublishing.co.uk/catalog/product_info.php?cPath=3&products_id=243en_US
dc.relation.ispartofJournal of Adhesive Dentistryen_US
dc.subject.meshAcid Etching, Dentalen_US
dc.subject.meshComposite Resins - Chemistryen_US
dc.subject.meshDental Bondingen_US
dc.subject.meshDental Leakage - Classificationen_US
dc.subject.meshDentin - Ultrastructureen_US
dc.subject.meshDentin-Bonding Agents - Chemistryen_US
dc.subject.meshDesiccationen_US
dc.subject.meshHumansen_US
dc.subject.meshLighten_US
dc.subject.meshMaterials Testingen_US
dc.subject.meshMicroscopy, Electronen_US
dc.subject.meshPermeabilityen_US
dc.subject.meshSilver Stainingen_US
dc.subject.meshSurface Propertiesen_US
dc.subject.meshTensile Strengthen_US
dc.subject.meshWater - Chemistryen_US
dc.titleFactors contributing to the incompatibility between simplified-step adhesives and chemically-cured or dual-cured composites. Part I. Single-step self-etching adhesiveen_US
dc.typeArticleen_US
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1461-5185&volume=5&spage=27&epage=40&date=2003&atitle=Factors+contributing+to+the+incompatibility+between+simplified-step+adhesive+and+chemical-cured+or+dual-cured+composites.+Part+I.+Single-step+self-etching+adhesives.+-
dc.identifier.emailTay, FRCM: franktay@HKUCC.hku.hken_US
dc.identifier.emailYiu, CKY: ckyyiu@hkucc.hku.hk-
dc.identifier.emailWei, SHY: cdowei@hkuxa.hku.hk-
dc.identifier.authorityYiu, CKY=rp00018en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.pmid12729081-
dc.identifier.scopuseid_2-s2.0-0042809979en_US
dc.identifier.hkuros108260-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0042809979&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume5en_US
dc.identifier.issue1en_US
dc.identifier.spage27en_US
dc.identifier.epage40en_US
dc.identifier.isiWOS:000221099200005-
dc.publisher.placeUnited Kingdomen_US
dc.identifier.scopusauthoridTay, FR=7102091962en_US
dc.identifier.scopusauthoridPashley, DH=35448600800en_US
dc.identifier.scopusauthoridYiu, CKY=7007115156en_US
dc.identifier.scopusauthoridSanares, AME=6506204353en_US
dc.identifier.scopusauthoridWei, SHY=7401765260en_US

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