Article: Erratum: Copper stabilization via spinel formation during the sintering of simulated copper-laden sludge with aluminum-rich ceramic precursors (Environmental Science and Technology (2011) 45 (3598-3604))

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TitleErratum: Copper stabilization via spinel formation during the sintering of simulated copper-laden sludge with aluminum-rich ceramic precursors (Environmental Science and Technology (2011) 45 (3598-3604))
AuthorsTang, Y1
Chui, SSY1
Shih, K1
Zhang, L1
Issue Date2011
PublisherAmerican Chemical Society. The Journal's web site is located at http://pubs.acs.org/est
CitationEnvironmental Science And Technology, 2011, v. 45 n. 17, p. 7609-7610 [How to Cite?]
DOI: http://dx.doi.org/10.1021/es202699c
ISSN0013-936X
2011 Impact Factor: 5.228
2011 SCImago Journal Rankings: 0.305
DOIhttp://dx.doi.org/10.1021/es202699c
ISI Accession Number IDWOS:000294373400081
DC Field
Value
dc.contributor.authorTang, Y
dc.contributor.authorChui, SSY
dc.contributor.authorShih, K
dc.contributor.authorZhang, L
dc.date.accessioned2012-06-26T06:05:59Z
dc.date.available2012-06-26T06:05:59Z
dc.date.issued2011
dc.description.natureLink_to_subscribed_fulltext
dc.identifier.citationEnvironmental Science And Technology, 2011, v. 45 n. 17, p. 7609-7610 [How to Cite?]
DOI: http://dx.doi.org/10.1021/es202699c
dc.identifier.doihttp://dx.doi.org/10.1021/es202699c
dc.identifier.epage7610
dc.identifier.isiWOS:000294373400081
dc.identifier.issn0013-936X
2011 Impact Factor: 5.228
2011 SCImago Journal Rankings: 0.305
dc.identifier.issue17
dc.identifier.scopuseid_2-s2.0-80052209723
dc.identifier.spage7609
dc.identifier.urihttp://hdl.handle.net/10722/150593
dc.identifier.volume45
dc.languageeng
dc.publisherAmerican Chemical Society. The Journal's web site is located at http://pubs.acs.org/est
dc.publisher.placeUnited States
dc.relation.ispartofEnvironmental Science and Technology
dc.titleErratum: Copper stabilization via spinel formation during the sintering of simulated copper-laden sludge with aluminum-rich ceramic precursors (Environmental Science and Technology (2011) 45 (3598-3604))
dc.typeArticle
Author Affiliations
  1. The University of Hong Kong