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Conference Paper: Design and modeling of liquid gallium contact RF MEMS switch

TitleDesign and modeling of liquid gallium contact RF MEMS switch
Authors
Issue Date2010
Citation
Proceedings Of The Asme Micro/Nanoscale Heat And Mass Transfer International Conference 2009, Mnhmt2009, 2010, v. 3, p. 191-198 How to Cite?
AbstractDue to the high power density and local temperature increase on nanoscopic asperities of solid metal contacts, traditional MEMS contact switches suffer from contact welding, pitting, electromigration and oxidation. Particularly, when MEMS switches are used to handle high power, solid metal contacts pose serious limitation on the contact reliability. A self-healing RF MEMS switch, which utilizes liquid gallium Contacts to take the place of the traditional solid metal-to-metal contacts, is proposed in this paper. Electrostatic actuation is Used to drive a silicon nitride bridge with upper electrodes. When the bridge is pulled down, liquid gallium droplets work as an interface between the upper and lower contact electrodes. The loss of the gallium droplets can be avoided due to the Unwettability of the material surrounding the contact electrodes. The switch is fabricated using a surface tnicromachining process. A coupled-field finite element pnalysis (FEA) is used to model the electric current, heating and thermal conduction of the contacts. The model includes deformable gallium droplets with 4 urn base diameter. The two sides of the droplets are connected to the upper and lower solid metal contact electrodes, respectively. By using the FEA models, the electric and thermal characteristics of the gallium droplets featuring a variety of geometric parameters have been studied. 1 A current handling capability of the liquid gallium pontact is verified by the FEA models. Copyright © 2009 by ASME.
Persistent Identifierhttp://hdl.handle.net/10722/149030
References

 

DC FieldValueLanguage
dc.contributor.authorLiu, Qen_HK
dc.contributor.authorTien, NCen_HK
dc.date.accessioned2012-06-20T06:17:59Z-
dc.date.available2012-06-20T06:17:59Z-
dc.date.issued2010en_HK
dc.identifier.citationProceedings Of The Asme Micro/Nanoscale Heat And Mass Transfer International Conference 2009, Mnhmt2009, 2010, v. 3, p. 191-198en_US
dc.identifier.urihttp://hdl.handle.net/10722/149030-
dc.description.abstractDue to the high power density and local temperature increase on nanoscopic asperities of solid metal contacts, traditional MEMS contact switches suffer from contact welding, pitting, electromigration and oxidation. Particularly, when MEMS switches are used to handle high power, solid metal contacts pose serious limitation on the contact reliability. A self-healing RF MEMS switch, which utilizes liquid gallium Contacts to take the place of the traditional solid metal-to-metal contacts, is proposed in this paper. Electrostatic actuation is Used to drive a silicon nitride bridge with upper electrodes. When the bridge is pulled down, liquid gallium droplets work as an interface between the upper and lower contact electrodes. The loss of the gallium droplets can be avoided due to the Unwettability of the material surrounding the contact electrodes. The switch is fabricated using a surface tnicromachining process. A coupled-field finite element pnalysis (FEA) is used to model the electric current, heating and thermal conduction of the contacts. The model includes deformable gallium droplets with 4 urn base diameter. The two sides of the droplets are connected to the upper and lower solid metal contact electrodes, respectively. By using the FEA models, the electric and thermal characteristics of the gallium droplets featuring a variety of geometric parameters have been studied. 1 A current handling capability of the liquid gallium pontact is verified by the FEA models. Copyright © 2009 by ASME.en_HK
dc.languageengen_US
dc.relation.ispartofProceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009en_HK
dc.titleDesign and modeling of liquid gallium contact RF MEMS switchen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailTien, NC: nctien@hku.hken_HK
dc.identifier.authorityTien, NC=rp01604en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-77954333853en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-77954333853&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume3en_HK
dc.identifier.spage191en_HK
dc.identifier.epage198en_HK
dc.identifier.scopusauthoridLiu, Q=36066088500en_HK
dc.identifier.scopusauthoridTien, NC=7006532826en_HK

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