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Conference Paper: Low-voltage lateral-contact microrelays for RF applications

TitleLow-voltage lateral-contact microrelays for RF applications
Authors
Issue Date2002
Citation
Proceedings Of The Ieee Micro Electro Mechanical Systems (Mems), 2002, p. 645-648 How to Cite?
AbstractThis paper reports the design and fabrication of a low-voltage lateral-contact microrelay for RF applications. The silicon surface micromachined relay utilizes electrothermal actuators and low-stress silicon nitride as a structural connection as well as electrical and thermal isolation. The sidewall contact is sputtered gold. The driving voltage is measured to be as low as 8V. RF testing shows that the microrelay has an off-state isolation of - 20dB at 12GHz. The simplicity of this four-mask fabrication process enables the possible integration with other RF MEMS components.
Persistent Identifierhttp://hdl.handle.net/10722/148999
References

 

DC FieldValueLanguage
dc.contributor.authorWang, Yen_HK
dc.contributor.authorLi, Zen_HK
dc.contributor.authorMcCormick, DTen_HK
dc.contributor.authorTien, NCen_HK
dc.date.accessioned2012-06-20T06:17:46Z-
dc.date.available2012-06-20T06:17:46Z-
dc.date.issued2002en_HK
dc.identifier.citationProceedings Of The Ieee Micro Electro Mechanical Systems (Mems), 2002, p. 645-648en_US
dc.identifier.urihttp://hdl.handle.net/10722/148999-
dc.description.abstractThis paper reports the design and fabrication of a low-voltage lateral-contact microrelay for RF applications. The silicon surface micromachined relay utilizes electrothermal actuators and low-stress silicon nitride as a structural connection as well as electrical and thermal isolation. The sidewall contact is sputtered gold. The driving voltage is measured to be as low as 8V. RF testing shows that the microrelay has an off-state isolation of - 20dB at 12GHz. The simplicity of this four-mask fabrication process enables the possible integration with other RF MEMS components.en_HK
dc.languageengen_US
dc.relation.ispartofProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)en_HK
dc.titleLow-voltage lateral-contact microrelays for RF applicationsen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailTien, NC: nctien@hku.hken_HK
dc.identifier.authorityTien, NC=rp01604en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0036122171en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0036122171&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spage645en_HK
dc.identifier.epage648en_HK
dc.identifier.scopusauthoridWang, Y=7601495931en_HK
dc.identifier.scopusauthoridLi, Z=24306828000en_HK
dc.identifier.scopusauthoridMcCormick, DT=7202521902en_HK
dc.identifier.scopusauthoridTien, NC=7006532826en_HK

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