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Article: Electrical discharge across micrometer-scale gaps for planar MEMS structures in air at atmospheric pressure

TitleElectrical discharge across micrometer-scale gaps for planar MEMS structures in air at atmospheric pressure
Authors
Issue Date2008
PublisherInstitute of Physics Publishing. The Journal's web site is located at http://www.iop.org/journals/jmm
Citation
Journal Of Micromechanics And Microengineering, 2008, v. 18 n. 7 How to Cite?
AbstractWe examine electrical discharge current responses across atmospheric pressure air gaps in the 2 νm to 7 νm range between planar polysilicon microstructures to determine the physical process of electrical discharge. The effect on discharge response from shape-related field enhancement is investigated through simulated field distribution and experimental current response for devices with design variations in electrode shape. Initial Townsend discharges, between 50 pA and 400 pA, transitioned to a second stage of 2 nA to 20 nA when the applied voltage increased 13% to 21% above the initial breakdown voltage. © 2008 IOP Publishing Ltd.
Persistent Identifierhttp://hdl.handle.net/10722/148956
ISSN
2015 Impact Factor: 1.768
2015 SCImago Journal Rankings: 0.674
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorStrong, FWen_HK
dc.contributor.authorSkinner, JLen_HK
dc.contributor.authorTien, NCen_HK
dc.date.accessioned2012-06-20T06:17:03Z-
dc.date.available2012-06-20T06:17:03Z-
dc.date.issued2008en_HK
dc.identifier.citationJournal Of Micromechanics And Microengineering, 2008, v. 18 n. 7en_HK
dc.identifier.issn0960-1317en_HK
dc.identifier.urihttp://hdl.handle.net/10722/148956-
dc.description.abstractWe examine electrical discharge current responses across atmospheric pressure air gaps in the 2 νm to 7 νm range between planar polysilicon microstructures to determine the physical process of electrical discharge. The effect on discharge response from shape-related field enhancement is investigated through simulated field distribution and experimental current response for devices with design variations in electrode shape. Initial Townsend discharges, between 50 pA and 400 pA, transitioned to a second stage of 2 nA to 20 nA when the applied voltage increased 13% to 21% above the initial breakdown voltage. © 2008 IOP Publishing Ltd.en_HK
dc.languageengen_US
dc.publisherInstitute of Physics Publishing. The Journal's web site is located at http://www.iop.org/journals/jmmen_HK
dc.relation.ispartofJournal of Micromechanics and Microengineeringen_HK
dc.titleElectrical discharge across micrometer-scale gaps for planar MEMS structures in air at atmospheric pressureen_HK
dc.typeArticleen_HK
dc.identifier.emailTien, NC: nctien@hku.hken_HK
dc.identifier.authorityTien, NC=rp01604en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1088/0960-1317/18/7/075025en_HK
dc.identifier.scopuseid_2-s2.0-47249130384en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-47249130384&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume18en_HK
dc.identifier.issue7en_HK
dc.identifier.eissn1361-6439-
dc.identifier.isiWOS:000257128100026-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridStrong, FW=13007548000en_HK
dc.identifier.scopusauthoridSkinner, JL=12764588800en_HK
dc.identifier.scopusauthoridTien, NC=7006532826en_HK

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