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Article: Collapse of microchannels during anodic bonding: Theory and experiments

TitleCollapse of microchannels during anodic bonding: Theory and experiments
Authors
Issue Date2004
PublisherAmerican Institute of Physics. The Journal's web site is located at http://jap.aip.org/jap/staff.jsp
Citation
Journal Of Applied Physics, 2004, v. 95 n. 5, p. 2800-2808 How to Cite?
AbstractThe microchannel collapse which was occurred during anodic bonding as a result of the high electric field inside the channel was investigated. An electromechanical theory to establish a criterion for the microchannel collapse was developed. It was observed that the collapse condition was independent of the thickness of the glass and the silicon wafer, and the dielectric constants of the silicon and glass. It was concluded that experimental results obtained by anodic bonding microchannels with different aspect ratio show good agreement with the theory developed.
Persistent Identifierhttp://hdl.handle.net/10722/148948
ISSN
2015 Impact Factor: 2.101
2015 SCImago Journal Rankings: 0.603
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorShin, WPen_HK
dc.contributor.authorHui, CYen_HK
dc.contributor.authorTien, NCen_HK
dc.date.accessioned2012-06-20T06:16:59Z-
dc.date.available2012-06-20T06:16:59Z-
dc.date.issued2004en_HK
dc.identifier.citationJournal Of Applied Physics, 2004, v. 95 n. 5, p. 2800-2808en_HK
dc.identifier.issn0021-8979en_HK
dc.identifier.urihttp://hdl.handle.net/10722/148948-
dc.description.abstractThe microchannel collapse which was occurred during anodic bonding as a result of the high electric field inside the channel was investigated. An electromechanical theory to establish a criterion for the microchannel collapse was developed. It was observed that the collapse condition was independent of the thickness of the glass and the silicon wafer, and the dielectric constants of the silicon and glass. It was concluded that experimental results obtained by anodic bonding microchannels with different aspect ratio show good agreement with the theory developed.en_HK
dc.languageengen_US
dc.publisherAmerican Institute of Physics. The Journal's web site is located at http://jap.aip.org/jap/staff.jspen_HK
dc.relation.ispartofJournal of Applied Physicsen_HK
dc.titleCollapse of microchannels during anodic bonding: Theory and experimentsen_HK
dc.typeArticleen_HK
dc.identifier.emailTien, NC: nctien@hku.hken_HK
dc.identifier.authorityTien, NC=rp01604en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1063/1.1644898en_HK
dc.identifier.scopuseid_2-s2.0-1642321075en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-1642321075&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume95en_HK
dc.identifier.issue5en_HK
dc.identifier.spage2800en_HK
dc.identifier.epage2808en_HK
dc.identifier.isiWOS:000189139600095-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridShin, WP=36830015800en_HK
dc.identifier.scopusauthoridHui, CY=7202876972en_HK
dc.identifier.scopusauthoridTien, NC=7006532826en_HK

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