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Article: Collapse of microchannels during anodic bonding: Theory and experiments
Title | Collapse of microchannels during anodic bonding: Theory and experiments |
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Authors | |
Issue Date | 2004 |
Publisher | American Institute of Physics. The Journal's web site is located at http://jap.aip.org/jap/staff.jsp |
Citation | Journal of Applied Physics, 2004, v. 95 n. 5, p. 2800-2808 How to Cite? |
Abstract | The microchannel collapse which was occurred during anodic bonding as a result of the high electric field inside the channel was investigated. An electromechanical theory to establish a criterion for the microchannel collapse was developed. It was observed that the collapse condition was independent of the thickness of the glass and the silicon wafer, and the dielectric constants of the silicon and glass. It was concluded that experimental results obtained by anodic bonding microchannels with different aspect ratio show good agreement with the theory developed. |
Persistent Identifier | http://hdl.handle.net/10722/148948 |
ISSN | 2023 Impact Factor: 2.7 2023 SCImago Journal Rankings: 0.649 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
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dc.contributor.author | Shin, WP | en_HK |
dc.contributor.author | Hui, CY | en_HK |
dc.contributor.author | Tien, NC | en_HK |
dc.date.accessioned | 2012-06-20T06:16:59Z | - |
dc.date.available | 2012-06-20T06:16:59Z | - |
dc.date.issued | 2004 | en_HK |
dc.identifier.citation | Journal of Applied Physics, 2004, v. 95 n. 5, p. 2800-2808 | - |
dc.identifier.issn | 0021-8979 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/148948 | - |
dc.description.abstract | The microchannel collapse which was occurred during anodic bonding as a result of the high electric field inside the channel was investigated. An electromechanical theory to establish a criterion for the microchannel collapse was developed. It was observed that the collapse condition was independent of the thickness of the glass and the silicon wafer, and the dielectric constants of the silicon and glass. It was concluded that experimental results obtained by anodic bonding microchannels with different aspect ratio show good agreement with the theory developed. | en_HK |
dc.language | eng | en_US |
dc.publisher | American Institute of Physics. The Journal's web site is located at http://jap.aip.org/jap/staff.jsp | en_HK |
dc.relation.ispartof | Journal of Applied Physics | en_HK |
dc.title | Collapse of microchannels during anodic bonding: Theory and experiments | en_HK |
dc.type | Article | en_HK |
dc.identifier.email | Tien, NC: nctien@hku.hk | en_HK |
dc.identifier.authority | Tien, NC=rp01604 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.doi | 10.1063/1.1644898 | en_HK |
dc.identifier.scopus | eid_2-s2.0-1642321075 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-1642321075&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 95 | en_HK |
dc.identifier.issue | 5 | en_HK |
dc.identifier.spage | 2800 | en_HK |
dc.identifier.epage | 2808 | en_HK |
dc.identifier.isi | WOS:000189139600095 | - |
dc.publisher.place | United States | en_HK |
dc.identifier.scopusauthorid | Shin, WP=36830015800 | en_HK |
dc.identifier.scopusauthorid | Hui, CY=7202876972 | en_HK |
dc.identifier.scopusauthorid | Tien, NC=7006532826 | en_HK |
dc.identifier.issnl | 0021-8979 | - |