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Article: Permalloy loaded transmission lines for high-speed interconnect applications

TitlePermalloy loaded transmission lines for high-speed interconnect applications
Authors
KeywordsCrosstalk
Ferromagnetic material (FMR)
High-speed interconnect
Inductance
Transmission lines
Issue Date2004
PublisherI E E E. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=16
Citation
Ieee Transactions On Electron Devices, 2004, v. 51 n. 1, p. 74-82 How to Cite?
AbstractThe mutual inductance and self-inductance of global interconnects are important but difficult to extract and model in deep submicrometer very large scale integration (VLSI) designs. The absence of effective mutual magnetic field shielding limits the maximum unbuffered interconnect line length. In this paper, we propose and demonstrate that permalloy-loaded transmission lines can be used for high-speed interconnect applications to overcome these limitations. Permalloy films were incorporated into planar transmission lines using a CMOS-compatible process. The line characteristics show that eddy-current effects are the limiting factors for the high-frequency permalloy applications when ferromagnetic resonance are restrained through geometry- design. Patterning permalloy films effectively extends their application to above 20 GHz. The line characteristic impedances are about ∼90 Ω. Under 50 mA dc current biases, the line parameters did not change much. Moreover, the patterned permalloy reduces the magnetic field coupling between two adjacent transmission lines by about 10 dB in our design. The demonstrated operation frequency range, current carrying capability and magnetic field shielding properties indicate that the permalloy loaded lines are suitable for high-speed interconnect applications in CMOS technologies.
Persistent Identifierhttp://hdl.handle.net/10722/148945
ISSN
2015 Impact Factor: 2.207
2015 SCImago Journal Rankings: 1.436
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorWang, Pen_HK
dc.contributor.authorTien, NCen_HK
dc.contributor.authorKan, ECCen_HK
dc.date.accessioned2012-06-20T06:16:58Z-
dc.date.available2012-06-20T06:16:58Z-
dc.date.issued2004en_HK
dc.identifier.citationIeee Transactions On Electron Devices, 2004, v. 51 n. 1, p. 74-82en_HK
dc.identifier.issn0018-9383en_HK
dc.identifier.urihttp://hdl.handle.net/10722/148945-
dc.description.abstractThe mutual inductance and self-inductance of global interconnects are important but difficult to extract and model in deep submicrometer very large scale integration (VLSI) designs. The absence of effective mutual magnetic field shielding limits the maximum unbuffered interconnect line length. In this paper, we propose and demonstrate that permalloy-loaded transmission lines can be used for high-speed interconnect applications to overcome these limitations. Permalloy films were incorporated into planar transmission lines using a CMOS-compatible process. The line characteristics show that eddy-current effects are the limiting factors for the high-frequency permalloy applications when ferromagnetic resonance are restrained through geometry- design. Patterning permalloy films effectively extends their application to above 20 GHz. The line characteristic impedances are about ∼90 Ω. Under 50 mA dc current biases, the line parameters did not change much. Moreover, the patterned permalloy reduces the magnetic field coupling between two adjacent transmission lines by about 10 dB in our design. The demonstrated operation frequency range, current carrying capability and magnetic field shielding properties indicate that the permalloy loaded lines are suitable for high-speed interconnect applications in CMOS technologies.en_HK
dc.languageengen_US
dc.publisherI E E E. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=16en_HK
dc.relation.ispartofIEEE Transactions on Electron Devicesen_HK
dc.subjectCrosstalken_HK
dc.subjectFerromagnetic material (FMR)en_HK
dc.subjectHigh-speed interconnecten_HK
dc.subjectInductanceen_HK
dc.subjectTransmission linesen_HK
dc.titlePermalloy loaded transmission lines for high-speed interconnect applicationsen_HK
dc.typeArticleen_HK
dc.identifier.emailTien, NC: nctien@hku.hken_HK
dc.identifier.authorityTien, NC=rp01604en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/TED.2003.820683en_HK
dc.identifier.scopuseid_2-s2.0-0742301760en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0742301760&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume51en_HK
dc.identifier.issue1en_HK
dc.identifier.spage74en_HK
dc.identifier.epage82en_HK
dc.identifier.isiWOS:000187959600011-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridWang, P=8847349400en_HK
dc.identifier.scopusauthoridTien, NC=7006532826en_HK
dc.identifier.scopusauthoridKan, ECC=36904161900en_HK

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