File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating

TitleFabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating
Authors
Issue Date2000
PublisherI E E E. The Journal's web site is located at http://www.ims2006.org
Citation
Ieee Mtt-S International Microwave Symposium Digest, 2000, v. 1, p. 279-282 How to Cite?
AbstractPolysilicon spiral inductors encapsulated with copper (Cu) were suspended over 30-μm-deep cavities in the silicon substrate beneath. The metallization process simultaneously coated the inner surfaces of the cavities with Cu to form both good radio-frequency (RF) ground and electromagnetic shield. Quality factor (Q) up to 30 and self-resonance frequency (f res) higher than 10 GHz were achieved for a 10.4-nH inductor. Simulation showed that the Cu-lined cavities reduced the mutual inductance between two adjacent inductors by a factor of 5, compared with that without the cavities. This proves that good shielding was provided by the cavities.
Persistent Identifierhttp://hdl.handle.net/10722/148937
ISSN
References

 

DC FieldValueLanguage
dc.contributor.authorJiang, Hen_HK
dc.contributor.authorWang, Yen_HK
dc.contributor.authorYeh, JLAen_HK
dc.contributor.authorTien, NCen_HK
dc.date.accessioned2012-06-20T06:16:55Z-
dc.date.available2012-06-20T06:16:55Z-
dc.date.issued2000en_HK
dc.identifier.citationIeee Mtt-S International Microwave Symposium Digest, 2000, v. 1, p. 279-282en_HK
dc.identifier.issn0149-645Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/148937-
dc.description.abstractPolysilicon spiral inductors encapsulated with copper (Cu) were suspended over 30-μm-deep cavities in the silicon substrate beneath. The metallization process simultaneously coated the inner surfaces of the cavities with Cu to form both good radio-frequency (RF) ground and electromagnetic shield. Quality factor (Q) up to 30 and self-resonance frequency (f res) higher than 10 GHz were achieved for a 10.4-nH inductor. Simulation showed that the Cu-lined cavities reduced the mutual inductance between two adjacent inductors by a factor of 5, compared with that without the cavities. This proves that good shielding was provided by the cavities.en_HK
dc.languageengen_US
dc.publisherI E E E. The Journal's web site is located at http://www.ims2006.orgen_HK
dc.relation.ispartofIEEE MTT-S International Microwave Symposium Digesten_HK
dc.titleFabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper platingen_HK
dc.typeArticleen_HK
dc.identifier.emailTien, NC: nctien@hku.hken_HK
dc.identifier.authorityTien, NC=rp01604en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0033709718en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0033709718&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume1en_HK
dc.identifier.spage279en_HK
dc.identifier.epage282en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridJiang, H=36120322000en_HK
dc.identifier.scopusauthoridWang, Y=7601495931en_HK
dc.identifier.scopusauthoridYeh, JLA=7201895883en_HK
dc.identifier.scopusauthoridTien, NC=7006532826en_HK

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats