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Article: Thick polysilicon surface micromachined optically sensed accelerometer

TitleThick polysilicon surface micromachined optically sensed accelerometer
Authors
Issue Date1999
PublisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Citation
Proceedings Of Spie - The International Society For Optical Engineering, 1999, v. 3630, p. 190-197 How to Cite?
AbstractAn accelerometer based on optical intensity modulation has been designed and fabricated using thick-polysilicon (12μm) surface-micromachining technology. A layer of polysilicon is surface micromachined to form a grating connected to springs, which are anchored on the silicon substrate. A layer of metal is evaporated on the top of the entire device making the suspended grating opaque as well as the regions on the substrate that are exposed by the grating. This leaves the areas directly beneath the grating shadowed from incident light. In the unperturbed state, the light that shines on the device is completely reflected by the metal on top of the entire device. When the grating moves under the influence of acceleration, the areas which are not covered by the metal are then exposed and the amount of light passing through the substrate increases. The optical intensity variation translates to the acceleration experienced by the grating proof mass. 12μm thick polysilicon surface micromachining was developed to improve the performance of the device. The film's mechanical qualities, internal stain, stress gradient and surface roughness have been characterized. This optical accelerometer has a sensitivity of 70 milli-g with 0.5-micron movement.
Persistent Identifierhttp://hdl.handle.net/10722/148936
ISSN

 

DC FieldValueLanguage
dc.contributor.authorChen, YHen_HK
dc.contributor.authorWang, Yen_HK
dc.contributor.authorTien, NCen_HK
dc.date.accessioned2012-06-20T06:16:55Z-
dc.date.available2012-06-20T06:16:55Z-
dc.date.issued1999en_HK
dc.identifier.citationProceedings Of Spie - The International Society For Optical Engineering, 1999, v. 3630, p. 190-197en_HK
dc.identifier.issn0277-786Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/148936-
dc.description.abstractAn accelerometer based on optical intensity modulation has been designed and fabricated using thick-polysilicon (12μm) surface-micromachining technology. A layer of polysilicon is surface micromachined to form a grating connected to springs, which are anchored on the silicon substrate. A layer of metal is evaporated on the top of the entire device making the suspended grating opaque as well as the regions on the substrate that are exposed by the grating. This leaves the areas directly beneath the grating shadowed from incident light. In the unperturbed state, the light that shines on the device is completely reflected by the metal on top of the entire device. When the grating moves under the influence of acceleration, the areas which are not covered by the metal are then exposed and the amount of light passing through the substrate increases. The optical intensity variation translates to the acceleration experienced by the grating proof mass. 12μm thick polysilicon surface micromachining was developed to improve the performance of the device. The film's mechanical qualities, internal stain, stress gradient and surface roughness have been characterized. This optical accelerometer has a sensitivity of 70 milli-g with 0.5-micron movement.en_HK
dc.languageengen_US
dc.publisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xmlen_HK
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineeringen_HK
dc.titleThick polysilicon surface micromachined optically sensed accelerometeren_HK
dc.typeArticleen_HK
dc.identifier.emailTien, NC: nctien@hku.hken_HK
dc.identifier.authorityTien, NC=rp01604en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0033608008en_HK
dc.identifier.volume3630en_HK
dc.identifier.spage190en_HK
dc.identifier.epage197en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridChen, YH=7601436639en_HK
dc.identifier.scopusauthoridWang, Y=7601495931en_HK
dc.identifier.scopusauthoridTien, NC=7006532826en_HK

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