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Conference Paper: Thermal resistivity and moisture migration of soil and cable trench backfill

TitleThermal resistivity and moisture migration of soil and cable trench backfill
Authors
KeywordsThermal factors
Moisture
Backfills
Issue Date2012
PublisherAmerican Society of Civil Engineers.
Citation
The 2012 GeoCongress, Oakland, CA., 25-29 March 2012. In Geotechnical Special Publications, 2012, v. 225, p. 4495-4504 How to Cite?
AbstractThere are many innovative applications of thermal properties of soil and backfill, such as geothermal cooling and heating systems, backfilling of high-voltage cable, etc., being developed. Therefore, there is a need to develop a better understanding of the thermal behavior of soil and backfill. The thermal resistivity and moisture migration behavior of a number of soils including those frequently used for high-voltage cable backfill have been studied in laboratory-scale and field-scale experiments, so as to evaluate their suitability as a backfill material. Thermal resistivity of small soil specimens was measured in the laboratory using a probe. Moreover, compaction mold thermal moisture migration tests were carried out for larger specimens in the laboratory. A full-scale field test was performed by means of a simulated cable installation. The results indicate in general that well-graded granular materials have the most desirable thermal behavior, and poorly graded soils (especially granular and coarse soils) have the least desirable thermal behavior, in terms of thermal resistivity and moisture migration driven by a thermal gradient.
DescriptionCongress Theme: State of the Art and Practice in Geotechnical Engineering
Poster Session - Emerging Topics in Geotechnical Engineering
Persistent Identifierhttp://hdl.handle.net/10722/146453
ISSN

 

DC FieldValueLanguage
dc.contributor.authorYeung, ATCen_US
dc.contributor.authorMorris, DVen_US
dc.date.accessioned2012-04-24T07:54:58Z-
dc.date.available2012-04-24T07:54:58Z-
dc.date.issued2012en_US
dc.identifier.citationThe 2012 GeoCongress, Oakland, CA., 25-29 March 2012. In Geotechnical Special Publications, 2012, v. 225, p. 4495-4504en_US
dc.identifier.issn0895-0563-
dc.identifier.urihttp://hdl.handle.net/10722/146453-
dc.descriptionCongress Theme: State of the Art and Practice in Geotechnical Engineering-
dc.descriptionPoster Session - Emerging Topics in Geotechnical Engineering-
dc.description.abstractThere are many innovative applications of thermal properties of soil and backfill, such as geothermal cooling and heating systems, backfilling of high-voltage cable, etc., being developed. Therefore, there is a need to develop a better understanding of the thermal behavior of soil and backfill. The thermal resistivity and moisture migration behavior of a number of soils including those frequently used for high-voltage cable backfill have been studied in laboratory-scale and field-scale experiments, so as to evaluate their suitability as a backfill material. Thermal resistivity of small soil specimens was measured in the laboratory using a probe. Moreover, compaction mold thermal moisture migration tests were carried out for larger specimens in the laboratory. A full-scale field test was performed by means of a simulated cable installation. The results indicate in general that well-graded granular materials have the most desirable thermal behavior, and poorly graded soils (especially granular and coarse soils) have the least desirable thermal behavior, in terms of thermal resistivity and moisture migration driven by a thermal gradient.-
dc.languageengen_US
dc.publisherAmerican Society of Civil Engineers.en_US
dc.relation.ispartofGeotechnical Special Publicationsen_US
dc.rightsGeotechnical Special Publications. Copyright © American Society of Civil Engineers.-
dc.subjectThermal factors-
dc.subjectMoisture-
dc.subjectBackfills-
dc.titleThermal resistivity and moisture migration of soil and cable trench backfillen_US
dc.typeConference_Paperen_US
dc.identifier.emailYeung, ATC: yeungat@hku.hken_US
dc.identifier.authorityYeung, ATC=rp00203en_US
dc.description.naturelink_to_OA_fulltext-
dc.identifier.doi10.1061/9780784412121.462-
dc.identifier.hkuros199125en_US
dc.identifier.volume225 GSP-
dc.identifier.spage4495en_US
dc.identifier.epage4504en_US
dc.publisher.placeUnited Statesen_US

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