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Conference Paper: Thermal resistivity and moisture migration of soil and cable trench backfill
Title | Thermal resistivity and moisture migration of soil and cable trench backfill |
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Authors | |
Keywords | Thermal factors Moisture Backfills |
Issue Date | 2012 |
Publisher | American Society of Civil Engineers. |
Citation | The 2012 GeoCongress, Oakland, CA., 25-29 March 2012. In Geotechnical Special Publications, 2012, v. 225, p. 4495-4504 How to Cite? |
Abstract | There are many innovative applications of thermal properties of soil and backfill, such as geothermal cooling and heating systems, backfilling of high-voltage cable, etc., being developed. Therefore, there is a need to develop a better understanding of the thermal behavior of soil and backfill. The thermal resistivity and moisture migration behavior of a number of soils including those frequently used for high-voltage cable backfill have been studied in laboratory-scale and field-scale experiments, so as to evaluate their suitability as a backfill material. Thermal resistivity of small soil specimens was measured in the laboratory using a probe. Moreover, compaction mold thermal moisture migration tests were carried out for larger specimens in the laboratory. A full-scale field test was performed by means of a simulated cable installation. The results indicate in general that well-graded granular materials have the most desirable thermal behavior, and poorly graded soils (especially granular and coarse soils) have the least desirable thermal behavior, in terms of thermal resistivity and moisture migration driven by a thermal gradient. |
Description | Congress Theme: State of the Art and Practice in Geotechnical Engineering Poster Session - Emerging Topics in Geotechnical Engineering |
Persistent Identifier | http://hdl.handle.net/10722/146453 |
ISSN | 2020 SCImago Journal Rankings: 0.258 |
DC Field | Value | Language |
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dc.contributor.author | Yeung, ATC | en_US |
dc.contributor.author | Morris, DV | en_US |
dc.date.accessioned | 2012-04-24T07:54:58Z | - |
dc.date.available | 2012-04-24T07:54:58Z | - |
dc.date.issued | 2012 | en_US |
dc.identifier.citation | The 2012 GeoCongress, Oakland, CA., 25-29 March 2012. In Geotechnical Special Publications, 2012, v. 225, p. 4495-4504 | en_US |
dc.identifier.issn | 0895-0563 | - |
dc.identifier.uri | http://hdl.handle.net/10722/146453 | - |
dc.description | Congress Theme: State of the Art and Practice in Geotechnical Engineering | - |
dc.description | Poster Session - Emerging Topics in Geotechnical Engineering | - |
dc.description.abstract | There are many innovative applications of thermal properties of soil and backfill, such as geothermal cooling and heating systems, backfilling of high-voltage cable, etc., being developed. Therefore, there is a need to develop a better understanding of the thermal behavior of soil and backfill. The thermal resistivity and moisture migration behavior of a number of soils including those frequently used for high-voltage cable backfill have been studied in laboratory-scale and field-scale experiments, so as to evaluate their suitability as a backfill material. Thermal resistivity of small soil specimens was measured in the laboratory using a probe. Moreover, compaction mold thermal moisture migration tests were carried out for larger specimens in the laboratory. A full-scale field test was performed by means of a simulated cable installation. The results indicate in general that well-graded granular materials have the most desirable thermal behavior, and poorly graded soils (especially granular and coarse soils) have the least desirable thermal behavior, in terms of thermal resistivity and moisture migration driven by a thermal gradient. | - |
dc.language | eng | en_US |
dc.publisher | American Society of Civil Engineers. | en_US |
dc.relation.ispartof | Geotechnical Special Publications | en_US |
dc.rights | Geotechnical Special Publications. Copyright © American Society of Civil Engineers. | - |
dc.subject | Thermal factors | - |
dc.subject | Moisture | - |
dc.subject | Backfills | - |
dc.title | Thermal resistivity and moisture migration of soil and cable trench backfill | en_US |
dc.type | Conference_Paper | en_US |
dc.identifier.email | Yeung, ATC: yeungat@hku.hk | en_US |
dc.identifier.authority | Yeung, ATC=rp00203 | en_US |
dc.description.nature | link_to_OA_fulltext | - |
dc.identifier.doi | 10.1061/9780784412121.462 | - |
dc.identifier.scopus | eid_2-s2.0-84888372669 | - |
dc.identifier.hkuros | 199125 | en_US |
dc.identifier.volume | 225 GSP | - |
dc.identifier.spage | 4495 | en_US |
dc.identifier.epage | 4504 | en_US |
dc.publisher.place | United States | en_US |
dc.identifier.issnl | 0895-0563 | - |