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Article: Fracture assessment of an interface crack between two dissimilar magnetoelectroelastic materials under heat flow and magnetoelectromechanical loadings
Title | Fracture assessment of an interface crack between two dissimilar magnetoelectroelastic materials under heat flow and magnetoelectromechanical loadings |
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Authors | |
Keywords | Fracture Frictionless interface Heat flow Interface crack Magnetoelectrically permeable crack |
Issue Date | 2011 |
Publisher | Chinese Society for Theoretical and Applied Mechanics. The Journal's web site is located at http://www.sciencedirect.com/science/journal/08949166 |
Citation | Acta Mechanica Solida Sinica, 2011, v. 24 n. 5, p. 429-438 How to Cite? |
Abstract | A magnetoelectrically permeable interface crack between two semi-infinite mag-netoelectroelastic planes under the action of a heat flow and remote magnetoelectromechanical loadings is considered, where the assumption of frictionless contact between two dissimilar half-planes is adopted. Not only the solutions of the interface crack problem are presented in an explicit form, but also the general condition for the transition from a perfect thermal contact of two mag-netoelectroelastic bodies to their separation is given. © 2011 The Chinese Society of Theoretical and Applied Mechanics. |
Persistent Identifier | http://hdl.handle.net/10722/145882 |
ISSN | 2021 Impact Factor: 2.187 2020 SCImago Journal Rankings: 0.540 |
References |
DC Field | Value | Language |
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dc.contributor.author | Ma, P | en_HK |
dc.contributor.author | Feng, W | - |
dc.contributor.author | Su, RKL | - |
dc.date.accessioned | 2012-03-27T08:58:17Z | - |
dc.date.available | 2012-03-27T08:58:17Z | - |
dc.date.issued | 2011 | en_HK |
dc.identifier.citation | Acta Mechanica Solida Sinica, 2011, v. 24 n. 5, p. 429-438 | en_HK |
dc.identifier.issn | 0894-9166 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/145882 | - |
dc.description.abstract | A magnetoelectrically permeable interface crack between two semi-infinite mag-netoelectroelastic planes under the action of a heat flow and remote magnetoelectromechanical loadings is considered, where the assumption of frictionless contact between two dissimilar half-planes is adopted. Not only the solutions of the interface crack problem are presented in an explicit form, but also the general condition for the transition from a perfect thermal contact of two mag-netoelectroelastic bodies to their separation is given. © 2011 The Chinese Society of Theoretical and Applied Mechanics. | en_HK |
dc.language | eng | en_US |
dc.publisher | Chinese Society for Theoretical and Applied Mechanics. The Journal's web site is located at http://www.sciencedirect.com/science/journal/08949166 | en_HK |
dc.relation.ispartof | Acta Mechanica Solida Sinica | en_HK |
dc.rights | The original publication is available at www.springerlink.com | en_US |
dc.subject | Fracture | en_HK |
dc.subject | Frictionless interface | en_HK |
dc.subject | Heat flow | en_HK |
dc.subject | Interface crack | en_HK |
dc.subject | Magnetoelectrically permeable crack | en_HK |
dc.title | Fracture assessment of an interface crack between two dissimilar magnetoelectroelastic materials under heat flow and magnetoelectromechanical loadings | en_HK |
dc.type | Article | en_HK |
dc.identifier.email | Feng, W: wjfeng@hku.hk | en_HK |
dc.identifier.email | Su, RKL: klsu@hkucc.hku.hk | - |
dc.identifier.authority | Su, RKL=rp00072 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1016/S0894-9166(11)60042-6 | en_HK |
dc.identifier.scopus | eid_2-s2.0-81055141005 | en_HK |
dc.identifier.hkuros | 199010 | en_US |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-81055141005&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 24 | en_HK |
dc.identifier.issue | 5 | en_HK |
dc.identifier.spage | 429 | en_HK |
dc.identifier.epage | 438 | en_HK |
dc.publisher.place | China | en_HK |
dc.identifier.scopusauthorid | Su, RKL=7102627096 | en_HK |
dc.identifier.scopusauthorid | Feng, W=7402351128 | en_HK |
dc.identifier.scopusauthorid | Ma, P=42961796100 | en_HK |
dc.identifier.issnl | 0894-9166 | - |