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Article: Studies on surface preparation and smoothness of nanostructured Bi 2Te 3-based alloys by electrochemical and mechanical methods

TitleStudies on surface preparation and smoothness of nanostructured Bi 2Te 3-based alloys by electrochemical and mechanical methods
Authors
KeywordsBismuth telluride based alloys
Chemical mechanical polishing
Electrolysis
Nanostructures
Thermoelectrics
Issue Date2011
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/electacta
Citation
Electrochimica Acta, 2011, v. 56 n. 8, p. 3079-3084 How to Cite?
AbstractSignificant improvements in the dimensionless thermoelectric figure-of-merit (ZT) for nanostructured bismuth telluride, Bi 2Te 3, and its alloys have been demonstrated. In designing high-performance thermoelectric devices, variations in the thermal and electrical contact resistances due to interfacial effects between the nanostructured alloy and the metallic electrodes remain a significant issue. Smooth scratch-free surfaces should provide a baseline for contact resistance studies. In this paper, the root mean square roughness over a 10 μm 2 of nanostructured bismuth tellurium based alloys was reduced from 133 nm to 1.9 nm by a procedure consisting of electrolysis, mechanical polishing, and chemical mechanical polishing (CMP). Post-CMP cleaning was also developed to yield a wettable surface for the subsequent conformable metallization. © 2010 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/142041
ISSN
2023 Impact Factor: 5.5
2023 SCImago Journal Rankings: 1.159
ISI Accession Number ID
Funding AgencyGrant Number
U.S. Department of Energy, Office of Science, Office of Basic Energy SciencesDE-SC0001299
Funding Information:

The authors thank Jonathan K. Tong and Dr. Sheng Shen for very helpful discussions and editorial assistance, and also thank Daniel Kraemer for fabricating the polishing jig. This work is supported by "Solid State Solar-Thermal Energy Conversion Center (S3TEC)", an Energy Frontier Research Center funded by the U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences under Award Number: DE-SC0001299 (G.C. and Z.F.R.).

References

 

DC FieldValueLanguage
dc.contributor.authorFeng, HPen_HK
dc.contributor.authorYu, Ben_HK
dc.contributor.authorChen, Sen_HK
dc.contributor.authorCollins, Ken_HK
dc.contributor.authorHe, Cen_HK
dc.contributor.authorRen, ZFen_HK
dc.contributor.authorChen, Gen_HK
dc.date.accessioned2011-10-10T07:13:46Z-
dc.date.available2011-10-10T07:13:46Z-
dc.date.issued2011en_HK
dc.identifier.citationElectrochimica Acta, 2011, v. 56 n. 8, p. 3079-3084en_HK
dc.identifier.issn0013-4686en_HK
dc.identifier.urihttp://hdl.handle.net/10722/142041-
dc.description.abstractSignificant improvements in the dimensionless thermoelectric figure-of-merit (ZT) for nanostructured bismuth telluride, Bi 2Te 3, and its alloys have been demonstrated. In designing high-performance thermoelectric devices, variations in the thermal and electrical contact resistances due to interfacial effects between the nanostructured alloy and the metallic electrodes remain a significant issue. Smooth scratch-free surfaces should provide a baseline for contact resistance studies. In this paper, the root mean square roughness over a 10 μm 2 of nanostructured bismuth tellurium based alloys was reduced from 133 nm to 1.9 nm by a procedure consisting of electrolysis, mechanical polishing, and chemical mechanical polishing (CMP). Post-CMP cleaning was also developed to yield a wettable surface for the subsequent conformable metallization. © 2010 Elsevier Ltd. All rights reserved.en_HK
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/electactaen_HK
dc.relation.ispartofElectrochimica Actaen_HK
dc.subjectBismuth telluride based alloysen_HK
dc.subjectChemical mechanical polishingen_HK
dc.subjectElectrolysisen_HK
dc.subjectNanostructuresen_HK
dc.subjectThermoelectricsen_HK
dc.titleStudies on surface preparation and smoothness of nanostructured Bi 2Te 3-based alloys by electrochemical and mechanical methodsen_HK
dc.typeArticleen_HK
dc.identifier.emailFeng, HP:hpfeng@hku.hken_HK
dc.identifier.authorityFeng, HP=rp01533en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.electacta.2010.12.008en_HK
dc.identifier.scopuseid_2-s2.0-79952445070en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-79952445070&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume56en_HK
dc.identifier.issue8en_HK
dc.identifier.spage3079en_HK
dc.identifier.epage3084en_HK
dc.identifier.isiWOS:000289133000014-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridFeng, HP=11739019400en_HK
dc.identifier.scopusauthoridYu, B=36351350900en_HK
dc.identifier.scopusauthoridChen, S=37051783100en_HK
dc.identifier.scopusauthoridCollins, K=35749491300en_HK
dc.identifier.scopusauthoridHe, C=37052310500en_HK
dc.identifier.scopusauthoridRen, ZF=7402408354en_HK
dc.identifier.scopusauthoridChen, G=35228853000en_HK
dc.identifier.citeulike8450014-
dc.identifier.issnl0013-4686-

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