Article: Nanoparticle-enabled selective electrodeposition
| Title | Nanoparticle-enabled selective electrodeposition | ||||||
|---|---|---|---|---|---|---|---|
| Authors | Feng, HP1 Paudel, T2 Yu, B2 Chen, S1 Ren, ZF2 Chen, G1 | ||||||
| Keywords | Adhesion Conductive glasses Electroplating Nanoparticles Nanosphere lithography | ||||||
| Issue Date | 2011 | ||||||
| Publisher | Wiley - V C H Verlag GmbH & Co KGaA | ||||||
| Citation | Advanced Materials, 2011, v. 23 n. 21, p. 2454-2459 [How to Cite?] DOI: http://dx.doi.org/10.1002/adma.201004656 | ||||||
| Abstract | Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. | ||||||
| ISSN | 0935-9648 2011 Impact Factor: 13.877 2011 SCImago Journal Rankings: 1.493 | ||||||
| DOI | http://dx.doi.org/10.1002/adma.201004656 | ||||||
| ISI Accession Number ID | WOS:000291732000009
Funding Information: The authors thank Dr. S. Shen for very helpful discussions, Jonathan K. Tong for editorial assistance, and the Postdoctoral Research Abroad Program supported by National Science Council of Republic of China, Taiwan. This work is supported partially as part of the "Solid State Solar-Thermal Energy Conversion Center" (S3TEC), an Energy Frontier Research Center funded by the U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences under Award Number: DE-SC0001299 (G.C. and Z.F.R.). | ||||||
| References | References in Scopus |
| dc.contributor.author | Feng, HP | ||||||
|---|---|---|---|---|---|---|---|
| dc.contributor.author | Paudel, T | ||||||
| dc.contributor.author | Yu, B | ||||||
| dc.contributor.author | Chen, S | ||||||
| dc.contributor.author | Ren, ZF | ||||||
| dc.contributor.author | Chen, G | ||||||
| dc.date.accessioned | 2011-10-10T07:13:44Z | ||||||
| dc.date.available | 2011-10-10T07:13:44Z | ||||||
| dc.date.issued | 2011 | ||||||
| dc.description.abstract | Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. | ||||||
| dc.description.nature | Link_to_subscribed_fulltext | ||||||
| dc.identifier.citation | Advanced Materials, 2011, v. 23 n. 21, p. 2454-2459 [How to Cite?] DOI: http://dx.doi.org/10.1002/adma.201004656 | ||||||
| dc.identifier.doi | http://dx.doi.org/10.1002/adma.201004656 | ||||||
| dc.identifier.epage | 2459 | ||||||
| dc.identifier.isi | WOS:000291732000009
Funding Information: The authors thank Dr. S. Shen for very helpful discussions, Jonathan K. Tong for editorial assistance, and the Postdoctoral Research Abroad Program supported by National Science Council of Republic of China, Taiwan. This work is supported partially as part of the "Solid State Solar-Thermal Energy Conversion Center" (S3TEC), an Energy Frontier Research Center funded by the U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences under Award Number: DE-SC0001299 (G.C. and Z.F.R.). | ||||||
| dc.identifier.issn | 0935-9648 2011 Impact Factor: 13.877 2011 SCImago Journal Rankings: 1.493 | ||||||
| dc.identifier.issue | 21 | ||||||
| dc.identifier.pmid | 21538987 | ||||||
| dc.identifier.scopus | eid_2-s2.0-79957861908 | ||||||
| dc.identifier.spage | 2454 | ||||||
| dc.identifier.uri | http://hdl.handle.net/10722/142040 | ||||||
| dc.identifier.volume | 23 | ||||||
| dc.publisher | Wiley - V C H Verlag GmbH & Co KGaA | ||||||
| dc.publisher.place | Germany | ||||||
| dc.relation.ispartof | Advanced Materials | ||||||
| dc.relation.references | References in Scopus | ||||||
| dc.subject.mesh | Adhesives - chemistry | ||||||
| dc.subject.mesh | Electric Conductivity | ||||||
| dc.subject.mesh | Electroplating - methods | ||||||
| dc.subject.mesh | Metal Nanoparticles - chemistry | ||||||
| dc.subject.mesh | Oxides - chemistry | ||||||
| dc.subject.mesh | Platinum - chemistry | ||||||
| dc.subject.mesh | Surface Properties | ||||||
| dc.subject | Adhesion | ||||||
| dc.subject | Conductive glasses | ||||||
| dc.subject | Electroplating | ||||||
| dc.subject | Nanoparticles | ||||||
| dc.subject | Nanosphere lithography | ||||||
| dc.title | Nanoparticle-enabled selective electrodeposition | ||||||
| dc.type | Article |
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