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Article: Nanoparticle-enabled selective electrodeposition
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TitleNanoparticle-enabled selective electrodeposition
 
AuthorsFeng, HP1
Paudel, T2
Yu, B2
Chen, S1
Ren, ZF2
Chen, G1
 
KeywordsAdhesion
Conductive glasses
Electroplating
Nanoparticles
Nanosphere lithography
 
Issue Date2011
 
PublisherWiley - V C H Verlag GmbH & Co KGaA
 
CitationAdvanced Materials, 2011, v. 23 n. 21, p. 2454-2459 [How to Cite?]
DOI: http://dx.doi.org/10.1002/adma.201004656
 
AbstractElectrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
 
ISSN0935-9648
2012 Impact Factor: 14.829
2012 SCImago Journal Rankings: 7.178
 
DOIhttp://dx.doi.org/10.1002/adma.201004656
 
ISI Accession Number IDWOS:000291732000009
Funding AgencyGrant Number
National Science Council of Republic of China, Taiwan
U.S. Department of Energy, Office of Science, Office of Basic Energy SciencesDE-SC0001299
Funding Information:

The authors thank Dr. S. Shen for very helpful discussions, Jonathan K. Tong for editorial assistance, and the Postdoctoral Research Abroad Program supported by National Science Council of Republic of China, Taiwan. This work is supported partially as part of the "Solid State Solar-Thermal Energy Conversion Center" (S3TEC), an Energy Frontier Research Center funded by the U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences under Award Number: DE-SC0001299 (G.C. and Z.F.R.).

 
ReferencesReferences in Scopus
 
DC FieldValue
dc.contributor.authorFeng, HP
 
dc.contributor.authorPaudel, T
 
dc.contributor.authorYu, B
 
dc.contributor.authorChen, S
 
dc.contributor.authorRen, ZF
 
dc.contributor.authorChen, G
 
dc.date.accessioned2011-10-10T07:13:44Z
 
dc.date.available2011-10-10T07:13:44Z
 
dc.date.issued2011
 
dc.description.abstractElectrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
 
dc.description.natureLink_to_subscribed_fulltext
 
dc.identifier.citationAdvanced Materials, 2011, v. 23 n. 21, p. 2454-2459 [How to Cite?]
DOI: http://dx.doi.org/10.1002/adma.201004656
 
dc.identifier.doihttp://dx.doi.org/10.1002/adma.201004656
 
dc.identifier.eissn1521-4095
 
dc.identifier.epage2459
 
dc.identifier.isiWOS:000291732000009
Funding AgencyGrant Number
National Science Council of Republic of China, Taiwan
U.S. Department of Energy, Office of Science, Office of Basic Energy SciencesDE-SC0001299
Funding Information:

The authors thank Dr. S. Shen for very helpful discussions, Jonathan K. Tong for editorial assistance, and the Postdoctoral Research Abroad Program supported by National Science Council of Republic of China, Taiwan. This work is supported partially as part of the "Solid State Solar-Thermal Energy Conversion Center" (S3TEC), an Energy Frontier Research Center funded by the U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences under Award Number: DE-SC0001299 (G.C. and Z.F.R.).

 
dc.identifier.issn0935-9648
2012 Impact Factor: 14.829
2012 SCImago Journal Rankings: 7.178
 
dc.identifier.issue21
 
dc.identifier.pmid21538987
 
dc.identifier.scopuseid_2-s2.0-79957861908
 
dc.identifier.spage2454
 
dc.identifier.urihttp://hdl.handle.net/10722/142040
 
dc.identifier.volume23
 
dc.publisherWiley - V C H Verlag GmbH & Co KGaA
 
dc.publisher.placeGermany
 
dc.relation.ispartofAdvanced Materials
 
dc.relation.referencesReferences in Scopus
 
dc.subject.meshAdhesives - chemistry
 
dc.subject.meshElectric Conductivity
 
dc.subject.meshElectroplating - methods
 
dc.subject.meshMetal Nanoparticles - chemistry
 
dc.subject.meshOxides - chemistry
 
dc.subject.meshPlatinum - chemistry
 
dc.subject.meshSurface Properties
 
dc.subjectAdhesion
 
dc.subjectConductive glasses
 
dc.subjectElectroplating
 
dc.subjectNanoparticles
 
dc.subjectNanosphere lithography
 
dc.titleNanoparticle-enabled selective electrodeposition
 
dc.typeArticle
 
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<contributor.author>Ren, ZF</contributor.author>
<contributor.author>Chen, G</contributor.author>
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Author Affiliations
  1. Massachusetts Institute of Technology
  2. Boston College