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Conference Paper: A non-thermal soldering technique to improve polymer based antenna performance

TitleA non-thermal soldering technique to improve polymer based antenna performance
Authors
KeywordsPolymer
Soldering technique
Transparent antenna
UWB
Issue Date2010
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000454
Citation
The 40th European Microwave Conference (EuMC 2010), Pairs, France, 28-30 September 2010. In Proceedings of EuMC 2010, 2010, p. 1476-1479 How to Cite?
AbstractA non-thermal soldering technique using cold solder or electrically conductive epoxy for connecting SMA connectors to polymer based antennas is proposed in this paper. The proposed technique prevents damage to the polymer due to the solder iron heat and also the loss of efficiency through the use of indirect connections of the coaxial feed via copper pads glued to the antenna. The direct connection of the feed points via SMA connectors on to a transparent antenna designed on AgHT-8 material has been demonstrated. The method can also be applied to solder the coaxial feed points directly to the antenna instead of using copper pads which will introduce additional reflection losses. The technique involves the use of colder soldering instead of hot soldering so as to not damage the polymer based antenna as well as improve the efficiency of the antenna. © 2010 EuMA.
DescriptionThe EuMC 2010 Conference was one of the 4 conferences held during the 13th European Microwave Week (EuMW2010): "Connecting the World", Paris, France, 26 September-1 October 2010.
Persistent Identifierhttp://hdl.handle.net/10722/140273
ISBN
References

 

DC FieldValueLanguage
dc.contributor.authorPeter, Ten_HK
dc.contributor.authorNilavalan, Ren_HK
dc.contributor.authorAbuTarboush, HFen_HK
dc.contributor.authorCheung, SWen_HK
dc.date.accessioned2011-09-23T06:09:29Z-
dc.date.available2011-09-23T06:09:29Z-
dc.date.issued2010en_HK
dc.identifier.citationThe 40th European Microwave Conference (EuMC 2010), Pairs, France, 28-30 September 2010. In Proceedings of EuMC 2010, 2010, p. 1476-1479en_HK
dc.identifier.isbn978-2-87487-016-3-
dc.identifier.urihttp://hdl.handle.net/10722/140273-
dc.descriptionThe EuMC 2010 Conference was one of the 4 conferences held during the 13th European Microwave Week (EuMW2010): "Connecting the World", Paris, France, 26 September-1 October 2010.-
dc.description.abstractA non-thermal soldering technique using cold solder or electrically conductive epoxy for connecting SMA connectors to polymer based antennas is proposed in this paper. The proposed technique prevents damage to the polymer due to the solder iron heat and also the loss of efficiency through the use of indirect connections of the coaxial feed via copper pads glued to the antenna. The direct connection of the feed points via SMA connectors on to a transparent antenna designed on AgHT-8 material has been demonstrated. The method can also be applied to solder the coaxial feed points directly to the antenna instead of using copper pads which will introduce additional reflection losses. The technique involves the use of colder soldering instead of hot soldering so as to not damage the polymer based antenna as well as improve the efficiency of the antenna. © 2010 EuMA.en_HK
dc.languageengen_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000454-
dc.relation.ispartofProceedings of the 40th European Microwave Conference, EuMC 2010en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsEuropean Microwave Conference Proceedings. Copyright © IEEE.-
dc.rights©2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.-
dc.subjectPolymeren_HK
dc.subjectSoldering techniqueen_HK
dc.subjectTransparent antennaen_HK
dc.subjectUWBen_HK
dc.titleA non-thermal soldering technique to improve polymer based antenna performanceen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=978-2-87487-016-3&volume=&spage=1476&epage=1479&date=2010&atitle=A+non-thermal+soldering+technique+to+improve+polymer+based+antenna+performance-
dc.identifier.emailCheung, SW:swcheung@eee.hku.hken_HK
dc.identifier.authorityCheung, SW=rp00102en_HK
dc.description.naturepublished_or_final_version-
dc.identifier.scopuseid_2-s2.0-78650040524en_HK
dc.identifier.hkuros195847en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-78650040524&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spage1476en_HK
dc.identifier.epage1479en_HK
dc.description.otherThe 40th European Microwave Conference (EuMC 2010), Pairs, France, 28-30 September 2010. In Proceedings of EuMC 2010, 2010, p. 1476-1479-
dc.identifier.scopusauthoridPeter, T=36161443200en_HK
dc.identifier.scopusauthoridNilavalan, R=6603111339en_HK
dc.identifier.scopusauthoridAbuTarboush, HF=26634701500en_HK
dc.identifier.scopusauthoridCheung, SW=7202472784en_HK

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