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Conference Paper: Time-domain field responses of the thin, high-contrast, finely layered structure in IC packagings

TitleTime-domain field responses of the thin, high-contrast, finely layered structure in IC packagings
Authors
KeywordsConductive properties
Electric field strength
Electric polarization
Feature structure
Ground planes
Issue Date2010
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000236
Citation
The 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2010), Austin, TX., 25-27 October 2010. In Proceedings of 19th EPEPS, 2010, p. 233-236 How to Cite?
AbstractThe thin, high-contrast, fine layers with dielectric and conductive properties, such as ground planes, are feature structures in IC packagings. Their responses to the pulsed electromagnetic field is important both theoretically and practically. In this paper, a new semi-analytical method is proposed to model the interaction of the layer with an incident electromagnetic field via a boundary condition that expresses the in-plane conduction and contrast electric polarization currents in terms of the exciting incident field by relating the jump in the tangential component of the magnetic field strength across the layer in terms of the (continuous) tangential component of the electric field strength in the layer. Expressions for pulse shapes of the reflected and transmitted fields are conveniently obtained based on this method. It provides a novel angle to investigate the ground plane effects inside IC packagings. ©2010 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/140264
ISBN
References

 

DC FieldValueLanguage
dc.contributor.authorDe Hoop, ATen_HK
dc.contributor.authorJiang, Len_HK
dc.date.accessioned2011-09-23T06:09:22Z-
dc.date.available2011-09-23T06:09:22Z-
dc.date.issued2010en_HK
dc.identifier.citationThe 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2010), Austin, TX., 25-27 October 2010. In Proceedings of 19th EPEPS, 2010, p. 233-236en_HK
dc.identifier.isbn978-1-4244-6867-6-
dc.identifier.urihttp://hdl.handle.net/10722/140264-
dc.description.abstractThe thin, high-contrast, fine layers with dielectric and conductive properties, such as ground planes, are feature structures in IC packagings. Their responses to the pulsed electromagnetic field is important both theoretically and practically. In this paper, a new semi-analytical method is proposed to model the interaction of the layer with an incident electromagnetic field via a boundary condition that expresses the in-plane conduction and contrast electric polarization currents in terms of the exciting incident field by relating the jump in the tangential component of the magnetic field strength across the layer in terms of the (continuous) tangential component of the electric field strength in the layer. Expressions for pulse shapes of the reflected and transmitted fields are conveniently obtained based on this method. It provides a novel angle to investigate the ground plane effects inside IC packagings. ©2010 IEEE.en_HK
dc.languageengen_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000236-
dc.relation.ispartofProceedings of the IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsProceedings of the IEEE Conference on Electrical Performance of Electronic Packaging and Systems. Copyright © IEEE.-
dc.rights©2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.-
dc.subjectConductive properties-
dc.subjectElectric field strength-
dc.subjectElectric polarization-
dc.subjectFeature structure-
dc.subjectGround planes-
dc.titleTime-domain field responses of the thin, high-contrast, finely layered structure in IC packagingsen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailJiang, L:ljiang@eee.hku.hken_HK
dc.identifier.authorityJiang, L=rp01338en_HK
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.1109/EPEPS.2010.5642586en_HK
dc.identifier.scopuseid_2-s2.0-78650929363en_HK
dc.identifier.hkuros195280en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-78650929363&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spage233en_HK
dc.identifier.epage236en_HK
dc.description.otherThe 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2010), Austin, TX., 25-27 October 2010. In Proceedings of 19th EPEPS, 2010, p. 233-236-
dc.identifier.scopusauthoridDe Hoop, AT=7005243861en_HK
dc.identifier.scopusauthoridJiang, L=36077777200en_HK

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