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- Publisher Website: 10.1109/EPEPS.2010.5642586
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Conference Paper: Time-domain field responses of the thin, high-contrast, finely layered structure in IC packagings
Title | Time-domain field responses of the thin, high-contrast, finely layered structure in IC packagings |
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Authors | |
Keywords | Conductive properties Electric field strength Electric polarization Feature structure Ground planes |
Issue Date | 2010 |
Publisher | IEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000236 |
Citation | The 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2010), Austin, TX., 25-27 October 2010. In Proceedings of 19th EPEPS, 2010, p. 233-236 How to Cite? |
Abstract | The thin, high-contrast, fine layers with dielectric and conductive properties, such as ground planes, are feature structures in IC packagings. Their responses to the pulsed electromagnetic field is important both theoretically and practically. In this paper, a new semi-analytical method is proposed to model the interaction of the layer with an incident electromagnetic field via a boundary condition that expresses the in-plane conduction and contrast electric polarization currents in terms of the exciting incident field by relating the jump in the tangential component of the magnetic field strength across the layer in terms of the (continuous) tangential component of the electric field strength in the layer. Expressions for pulse shapes of the reflected and transmitted fields are conveniently obtained based on this method. It provides a novel angle to investigate the ground plane effects inside IC packagings. ©2010 IEEE. |
Persistent Identifier | http://hdl.handle.net/10722/140264 |
ISBN | |
References |
DC Field | Value | Language |
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dc.contributor.author | De Hoop, AT | en_HK |
dc.contributor.author | Jiang, L | en_HK |
dc.date.accessioned | 2011-09-23T06:09:22Z | - |
dc.date.available | 2011-09-23T06:09:22Z | - |
dc.date.issued | 2010 | en_HK |
dc.identifier.citation | The 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2010), Austin, TX., 25-27 October 2010. In Proceedings of 19th EPEPS, 2010, p. 233-236 | en_HK |
dc.identifier.isbn | 978-1-4244-6867-6 | - |
dc.identifier.uri | http://hdl.handle.net/10722/140264 | - |
dc.description.abstract | The thin, high-contrast, fine layers with dielectric and conductive properties, such as ground planes, are feature structures in IC packagings. Their responses to the pulsed electromagnetic field is important both theoretically and practically. In this paper, a new semi-analytical method is proposed to model the interaction of the layer with an incident electromagnetic field via a boundary condition that expresses the in-plane conduction and contrast electric polarization currents in terms of the exciting incident field by relating the jump in the tangential component of the magnetic field strength across the layer in terms of the (continuous) tangential component of the electric field strength in the layer. Expressions for pulse shapes of the reflected and transmitted fields are conveniently obtained based on this method. It provides a novel angle to investigate the ground plane effects inside IC packagings. ©2010 IEEE. | en_HK |
dc.language | eng | en_US |
dc.publisher | IEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000236 | - |
dc.relation.ispartof | Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 | en_HK |
dc.rights | ©2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. | - |
dc.subject | Conductive properties | - |
dc.subject | Electric field strength | - |
dc.subject | Electric polarization | - |
dc.subject | Feature structure | - |
dc.subject | Ground planes | - |
dc.title | Time-domain field responses of the thin, high-contrast, finely layered structure in IC packagings | en_HK |
dc.type | Conference_Paper | en_HK |
dc.identifier.email | Jiang, L:ljiang@eee.hku.hk | en_HK |
dc.identifier.authority | Jiang, L=rp01338 | en_HK |
dc.description.nature | published_or_final_version | - |
dc.identifier.doi | 10.1109/EPEPS.2010.5642586 | en_HK |
dc.identifier.scopus | eid_2-s2.0-78650929363 | en_HK |
dc.identifier.hkuros | 195280 | en_US |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-78650929363&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.spage | 233 | en_HK |
dc.identifier.epage | 236 | en_HK |
dc.description.other | The 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2010), Austin, TX., 25-27 October 2010. In Proceedings of 19th EPEPS, 2010, p. 233-236 | - |
dc.identifier.scopusauthorid | De Hoop, AT=7005243861 | en_HK |
dc.identifier.scopusauthorid | Jiang, L=36077777200 | en_HK |