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Conference Paper: Augmented EPA with augmented EFIE method for packaging analysis

TitleAugmented EPA with augmented EFIE method for packaging analysis
Authors
KeywordsAugmented EFIE
Electric field integral equation
Electromagnetic modelling
Equivalence principles
Equivalence surface
Issue Date2010
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1002555
Citation
The 2010 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), Singapore, 7-9 December 2010. In Proceedings of EDAPS, 2010, p. 1-4 How to Cite?
AbstractIt is evident that the low frequency full wave electromagnetic modelling is necessary for IC packaging analysis. Considering the complexity, it is very difficult to solve the whole problem directly. Even though the domain decomposition method is a legitimate approach for these types of problems, the domain decomposition method based on the equivalence principle has the low frequency breakdown issue. In this paper, we developed a low frequency augmented equivalence principle algorithm (AEPA) with the augmented electric field integral equation (AEFIE) for packaging and IC analysis. On the equivalence surfaces, not only the electric current and the magnetic current, but also the electric charge and the magnetic charge are used to capture the low frequency couplings. Inside each AEPA box, AEFIE is applied to maintain the low frequency accuracy. As a result, we are able to solve low frequency domain decomposition problems and apply it to IC packaging analysis.
Persistent Identifierhttp://hdl.handle.net/10722/140263
ISBN
References

 

DC FieldValueLanguage
dc.contributor.authorMa, Zen_HK
dc.contributor.authorJiang, Len_HK
dc.contributor.authorChew, Wen_HK
dc.contributor.authorLi, Men_HK
dc.contributor.authorQian, Zen_HK
dc.date.accessioned2011-09-23T06:09:22Z-
dc.date.available2011-09-23T06:09:22Z-
dc.date.issued2010en_HK
dc.identifier.citationThe 2010 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), Singapore, 7-9 December 2010. In Proceedings of EDAPS, 2010, p. 1-4en_HK
dc.identifier.isbn978-1-4244-9068-4-
dc.identifier.urihttp://hdl.handle.net/10722/140263-
dc.description.abstractIt is evident that the low frequency full wave electromagnetic modelling is necessary for IC packaging analysis. Considering the complexity, it is very difficult to solve the whole problem directly. Even though the domain decomposition method is a legitimate approach for these types of problems, the domain decomposition method based on the equivalence principle has the low frequency breakdown issue. In this paper, we developed a low frequency augmented equivalence principle algorithm (AEPA) with the augmented electric field integral equation (AEFIE) for packaging and IC analysis. On the equivalence surfaces, not only the electric current and the magnetic current, but also the electric charge and the magnetic charge are used to capture the low frequency couplings. Inside each AEPA box, AEFIE is applied to maintain the low frequency accuracy. As a result, we are able to solve low frequency domain decomposition problems and apply it to IC packaging analysis.en_HK
dc.languageengen_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1002555-
dc.relation.ispartof2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010en_HK
dc.rightsProceedings of the IEEE Electrical Design of Advanced Packaging and Systems Symposium. Copyright © IEEE.-
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rights©2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.-
dc.subjectAugmented EFIE-
dc.subjectElectric field integral equation-
dc.subjectElectromagnetic modelling-
dc.subjectEquivalence principles-
dc.subjectEquivalence surface-
dc.titleAugmented EPA with augmented EFIE method for packaging analysisen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailJiang, L: jianglj@hku.hken_HK
dc.identifier.emailChew, W: wcchew@hku.hken_HK
dc.identifier.authorityJiang, L=rp01338en_HK
dc.identifier.authorityChew, W=rp00656en_HK
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.1109/EDAPS.2010.5683002en_HK
dc.identifier.scopuseid_2-s2.0-79851501109en_HK
dc.identifier.hkuros195278en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-79851501109&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spage1en_US
dc.identifier.epage4en_US
dc.description.otherThe 2010 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), Singapore, 7-9 December 2010. In Proceedings of EDAPS, 2010, p. 1-4-
dc.identifier.scopusauthoridMa, Z=24483672700en_HK
dc.identifier.scopusauthoridJiang, L=36077777200en_HK
dc.identifier.scopusauthoridChew, W=36014436300en_HK
dc.identifier.scopusauthoridLi, M=36959572700en_HK
dc.identifier.scopusauthoridQian, Z=9043842600en_HK

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