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Conference Paper: Effects of electro- Fenton process on blood compatibility and nickel suppression of NiTi shape memory alloy

TitleEffects of electro- Fenton process on blood compatibility and nickel suppression of NiTi shape memory alloy
Authors
KeywordsBlood compatibility
Electro-Fenton process
Nickel suppression
NiTi shape memory alloy
Issue Date2008
PublisherTrans Tech Publications Ltd.. The Journal's web site is located at http://www.scitec.ch/1022-6680/
Citation
Advanced Materials Research, 2008, v. 47-50 pt. 1, p. 314-317 How to Cite?
AbstractElectro-Fenton process as a modified Fenton's oxidation method in waster water treatment can provide a stable hydroxyl radical (·OH) source by continuous reaction of electrochemically generated H2O2 with Fe2+ ions for surface oxidation modification of NiTi shape memory alloy (SMA). In this work, effects of electro-Fenton process on blood compatibility and nickel suppression of NiTi SMA were investigated by SEM and XPS, inductively-coupled plasma mass spectrometry (ICPMS), hemolysis analysis and blood platelet adhesion test. It is found that electro-Fenton process is a notably effective way to impede out-diffusion of Ni from NiTi SMA in simulated body fluids during the entire ten week immersion period. It can also improve the hemolysis resistance and thromboresistance of biomedical NiTi SMA. The improvement of blood compatibility and nickel suppression of NiTi SMA can be attributed to the formation of surface titania film with a Ni-free zone near its top surface by electro-Fenton process. © 2008 Trans Tech Publications.
DescriptionPaper from International Conference on Multifunctional Materials and Structures, Hong Kong, July 28-31 2008
Persistent Identifierhttp://hdl.handle.net/10722/139538
ISSN
2015 SCImago Journal Rankings: 0.115
References

 

DC FieldValueLanguage
dc.contributor.authorChu, CLen_HK
dc.contributor.authorHu, Ten_HK
dc.contributor.authorWu, SLen_HK
dc.contributor.authorPu, YPen_HK
dc.contributor.authorChung, CYen_HK
dc.contributor.authorYeung, KWKen_HK
dc.contributor.authorChu, PKen_HK
dc.date.accessioned2011-09-23T05:51:23Z-
dc.date.available2011-09-23T05:51:23Z-
dc.date.issued2008en_HK
dc.identifier.citationAdvanced Materials Research, 2008, v. 47-50 pt. 1, p. 314-317en_US
dc.identifier.issn1022-6680en_HK
dc.identifier.urihttp://hdl.handle.net/10722/139538-
dc.descriptionPaper from International Conference on Multifunctional Materials and Structures, Hong Kong, July 28-31 2008-
dc.description.abstractElectro-Fenton process as a modified Fenton's oxidation method in waster water treatment can provide a stable hydroxyl radical (·OH) source by continuous reaction of electrochemically generated H2O2 with Fe2+ ions for surface oxidation modification of NiTi shape memory alloy (SMA). In this work, effects of electro-Fenton process on blood compatibility and nickel suppression of NiTi SMA were investigated by SEM and XPS, inductively-coupled plasma mass spectrometry (ICPMS), hemolysis analysis and blood platelet adhesion test. It is found that electro-Fenton process is a notably effective way to impede out-diffusion of Ni from NiTi SMA in simulated body fluids during the entire ten week immersion period. It can also improve the hemolysis resistance and thromboresistance of biomedical NiTi SMA. The improvement of blood compatibility and nickel suppression of NiTi SMA can be attributed to the formation of surface titania film with a Ni-free zone near its top surface by electro-Fenton process. © 2008 Trans Tech Publications.en_HK
dc.languageengen_US
dc.publisherTrans Tech Publications Ltd.. The Journal's web site is located at http://www.scitec.ch/1022-6680/en_HK
dc.relation.ispartofAdvanced Materials Researchen_HK
dc.subjectBlood compatibilityen_HK
dc.subjectElectro-Fenton processen_HK
dc.subjectNickel suppressionen_HK
dc.subjectNiTi shape memory alloyen_HK
dc.titleEffects of electro- Fenton process on blood compatibility and nickel suppression of NiTi shape memory alloyen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailYeung, KWK:wkkyeung@hkucc.hku.hken_HK
dc.identifier.authorityYeung, KWK=rp00309en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.4028/www.scientific.net/AMR.47-50.314-
dc.identifier.scopuseid_2-s2.0-56349130588en_HK
dc.identifier.hkuros192168en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-56349130588&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume47-50 PART 1en_HK
dc.identifier.spage314en_HK
dc.identifier.epage317en_HK
dc.publisher.placeSwitzerlanden_HK
dc.identifier.scopusauthoridChu, CL=7404345713en_HK
dc.identifier.scopusauthoridHu, T=25948400300en_HK
dc.identifier.scopusauthoridWu, SL=15125218800en_HK
dc.identifier.scopusauthoridPu, YP=7103191509en_HK
dc.identifier.scopusauthoridChung, CY=8100842800en_HK
dc.identifier.scopusauthoridYeung, KWK=13309584700en_HK
dc.identifier.scopusauthoridChu, PK=36040705700en_HK

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