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Conference Paper: Fabrication of titania film on NiTi alloy by a deposition-assisted advanced oxidation method

TitleFabrication of titania film on NiTi alloy by a deposition-assisted advanced oxidation method
Authors
KeywordsDeposition-assisted advanced oxidation
NiTi
Shape memory alloy
Titania film
Issue Date2008
PublisherTrans Tech Publications Ltd.. The Journal's web site is located at http://www.scitec.ch/1022-6680/
Citation
Advanced Materials Research, 2008, v. 47-50 pt. 1, p. 310-313 How to Cite?
AbstractA graded titania film was formed on chemically polished NiTi shape memory alloy (SMA) by a novel deposition-assisted advanced oxidation method in a modified Fenton's reagent containing titanium tetrachloride and then characterized by SEM and XPS. The effects of the titania film on leaching of harmful Ni ions from the NiTi substrate in simulated body fluids (SBF) is assessed by inductively-coupled plasma mass spectrometry (ICPMS). The results indicate that a thick and dense titania film was successfully fabricated in this in situ advanced oxidation reaction assisted with an additional deposition process by the hydrolysis of titanium tetrachloride on NiTi. The titania film can dramatically reduces Ni leaching from NiTi. XPS depth profiles show that the film possesses a smooth graded interfacial structure that boost mechanical stability. © 2008 Trans Tech Publications.
DescriptionPaper from International Conference on Multifunctional Materials and Structures, Hong Kong, 28-31 July 2008
Persistent Identifierhttp://hdl.handle.net/10722/139537
ISSN
2015 SCImago Journal Rankings: 0.115
References

 

DC FieldValueLanguage
dc.contributor.authorChu, CLen_HK
dc.contributor.authorHu, Ten_HK
dc.contributor.authorWu, SLen_HK
dc.contributor.authorChung, CYen_HK
dc.contributor.authorYeung, KWKen_HK
dc.contributor.authorChu, PKen_HK
dc.date.accessioned2011-09-23T05:51:23Z-
dc.date.available2011-09-23T05:51:23Z-
dc.date.issued2008en_HK
dc.identifier.citationAdvanced Materials Research, 2008, v. 47-50 pt. 1, p. 310-313en_US
dc.identifier.issn1022-6680en_HK
dc.identifier.urihttp://hdl.handle.net/10722/139537-
dc.descriptionPaper from International Conference on Multifunctional Materials and Structures, Hong Kong, 28-31 July 2008-
dc.description.abstractA graded titania film was formed on chemically polished NiTi shape memory alloy (SMA) by a novel deposition-assisted advanced oxidation method in a modified Fenton's reagent containing titanium tetrachloride and then characterized by SEM and XPS. The effects of the titania film on leaching of harmful Ni ions from the NiTi substrate in simulated body fluids (SBF) is assessed by inductively-coupled plasma mass spectrometry (ICPMS). The results indicate that a thick and dense titania film was successfully fabricated in this in situ advanced oxidation reaction assisted with an additional deposition process by the hydrolysis of titanium tetrachloride on NiTi. The titania film can dramatically reduces Ni leaching from NiTi. XPS depth profiles show that the film possesses a smooth graded interfacial structure that boost mechanical stability. © 2008 Trans Tech Publications.en_HK
dc.languageengen_US
dc.publisherTrans Tech Publications Ltd.. The Journal's web site is located at http://www.scitec.ch/1022-6680/en_HK
dc.relation.ispartofAdvanced Materials Researchen_HK
dc.subjectDeposition-assisted advanced oxidationen_HK
dc.subjectNiTien_HK
dc.subjectShape memory alloyen_HK
dc.subjectTitania filmen_HK
dc.titleFabrication of titania film on NiTi alloy by a deposition-assisted advanced oxidation methoden_HK
dc.typeConference_Paperen_HK
dc.identifier.emailYeung, KWK:wkkyeung@hkucc.hku.hken_HK
dc.identifier.authorityYeung, KWK=rp00309en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.4028/www.scientific.net/AMR.47-50.310-
dc.identifier.scopuseid_2-s2.0-56349129610en_HK
dc.identifier.hkuros192166en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-56349129610&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume47-50 PART 1en_HK
dc.identifier.spage310en_HK
dc.identifier.epage313en_HK
dc.publisher.placeSwitzerlanden_HK
dc.identifier.scopusauthoridChu, CL=7404345713en_HK
dc.identifier.scopusauthoridHu, T=25948400300en_HK
dc.identifier.scopusauthoridWu, SL=15125218800en_HK
dc.identifier.scopusauthoridChung, CY=8100842800en_HK
dc.identifier.scopusauthoridYeung, KWK=13309584700en_HK
dc.identifier.scopusauthoridChu, PK=36040705700en_HK

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