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Article: Nano-scale surface morphology, wettability and osteoblast adhesion on nitrogen plasma-implanted NiTi shape memory alloy

TitleNano-scale surface morphology, wettability and osteoblast adhesion on nitrogen plasma-implanted NiTi shape memory alloy
Authors
KeywordsNiTi
Plasma immersion ion implantation
Pulsing frequency
Surface free energy
Surface morphology and roughness
Issue Date2009
PublisherAmerican Scientific Publishers. The Journal's web site is located at http://aspbs.com/jnn/
Citation
Journal Of Nanoscience And Nanotechnology, 2009, v. 9 n. 6, p. 3449-3454 How to Cite?
AbstractPlasma immersion ion implantation (PIN) is an effective method to increase the corrosion resistance and inhibit nickel release from orthopedic NiTi shape memory alloy. Nitrogen was plasma-implanted into NiTi using different pulsing frequencies to investigate the effects on the nano-scale surface morphology, structure, wettability, as well as biocompatibility. X-ray photoelectron spectroscopy (XPS) results show that the implantation depth of nitrogen increases with higher pulsing frequencies. Atomic force microscopy (AFM) discloses that the nano-scale surface roughness increases and surface features are changed from islands to spiky cones with higher pulsing frequencies. This variation in the nano surface structures leads to different surface free energy (SFE) monitored by contact angle measurements. The adhesion, spreading, and proliferation of osteoblasts on the implanted NiTi surface are assessed by cell culture tests. Our results indicate that the nano-scale surface morphology that is altered by the implantation frequencies impacts the surface free energy and wettability of the NiTi surfaces, and in turn affects the osteoblast adhesion behavior. Copyright © 2009 American Scientific Publishers All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/139532
ISSN
2015 Impact Factor: 1.338
2015 SCImago Journal Rankings: 0.358
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorLiu, XMen_HK
dc.contributor.authorL Wu, Sen_HK
dc.contributor.authorChu, PKen_HK
dc.contributor.authorChung, CYen_HK
dc.contributor.authorChu, CLen_HK
dc.contributor.authorChan, YLen_HK
dc.contributor.authorLam, KOen_HK
dc.contributor.authorYeung, KWKen_HK
dc.contributor.authorLu, WWen_HK
dc.contributor.authorCheung, KMCen_HK
dc.contributor.authorLuk, KDKen_HK
dc.date.accessioned2011-09-23T05:51:20Z-
dc.date.available2011-09-23T05:51:20Z-
dc.date.issued2009en_HK
dc.identifier.citationJournal Of Nanoscience And Nanotechnology, 2009, v. 9 n. 6, p. 3449-3454en_HK
dc.identifier.issn1533-4880en_HK
dc.identifier.urihttp://hdl.handle.net/10722/139532-
dc.description.abstractPlasma immersion ion implantation (PIN) is an effective method to increase the corrosion resistance and inhibit nickel release from orthopedic NiTi shape memory alloy. Nitrogen was plasma-implanted into NiTi using different pulsing frequencies to investigate the effects on the nano-scale surface morphology, structure, wettability, as well as biocompatibility. X-ray photoelectron spectroscopy (XPS) results show that the implantation depth of nitrogen increases with higher pulsing frequencies. Atomic force microscopy (AFM) discloses that the nano-scale surface roughness increases and surface features are changed from islands to spiky cones with higher pulsing frequencies. This variation in the nano surface structures leads to different surface free energy (SFE) monitored by contact angle measurements. The adhesion, spreading, and proliferation of osteoblasts on the implanted NiTi surface are assessed by cell culture tests. Our results indicate that the nano-scale surface morphology that is altered by the implantation frequencies impacts the surface free energy and wettability of the NiTi surfaces, and in turn affects the osteoblast adhesion behavior. Copyright © 2009 American Scientific Publishers All rights reserved.en_HK
dc.languageengen_US
dc.publisherAmerican Scientific Publishers. The Journal's web site is located at http://aspbs.com/jnn/en_HK
dc.relation.ispartofJournal of Nanoscience and Nanotechnologyen_HK
dc.subjectNiTien_HK
dc.subjectPlasma immersion ion implantationen_HK
dc.subjectPulsing frequencyen_HK
dc.subjectSurface free energyen_HK
dc.subjectSurface morphology and roughnessen_HK
dc.titleNano-scale surface morphology, wettability and osteoblast adhesion on nitrogen plasma-implanted NiTi shape memory alloyen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1533-4880&volume=9&issue=6&spage=3449&epage=3454&date=2009&atitle=Nano-scale+surface+morphology,+wettability+and+osteoblast+adhesion+on+nitrogen+plasma-implanted+NiTi+shape+memory+alloy-
dc.identifier.emailYeung, KWK:wkkyeung@hkucc.hku.hken_HK
dc.identifier.emailLu, WW:wwlu@hku.hken_HK
dc.identifier.emailCheung, KMC:cheungmc@hku.hken_HK
dc.identifier.emailLuk, KDK:hcm21000@hku.hken_HK
dc.identifier.authorityYeung, KWK=rp00309en_HK
dc.identifier.authorityLu, WW=rp00411en_HK
dc.identifier.authorityCheung, KMC=rp00387en_HK
dc.identifier.authorityLuk, KDK=rp00333en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1166/jnn.2009.NS15en_HK
dc.identifier.pmid19504867-
dc.identifier.scopuseid_2-s2.0-67649216934en_HK
dc.identifier.hkuros192139en_US
dc.identifier.hkuros166728-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-67649216934&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume9en_HK
dc.identifier.issue6en_HK
dc.identifier.spage3449en_HK
dc.identifier.epage3454en_HK
dc.identifier.isiWOS:000265794500015-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridLiu, XM=8408205200en_HK
dc.identifier.scopusauthoridL Wu, S=15125218800en_HK
dc.identifier.scopusauthoridChu, PK=36040705700en_HK
dc.identifier.scopusauthoridChung, CY=8100842800en_HK
dc.identifier.scopusauthoridChu, CL=7404345713en_HK
dc.identifier.scopusauthoridChan, YL=8250546500en_HK
dc.identifier.scopusauthoridLam, KO=22980533000en_HK
dc.identifier.scopusauthoridYeung, KWK=13309584700en_HK
dc.identifier.scopusauthoridLu, WW=7404215221en_HK
dc.identifier.scopusauthoridCheung, KMC=7402406754en_HK
dc.identifier.scopusauthoridLuk, KDK=7201921573en_HK
dc.identifier.citeulike4366383-

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