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Article: A novel technique and soldering method to improve performance of transparent polymer antennas

TitleA novel technique and soldering method to improve performance of transparent polymer antennas
Authors
KeywordsCold soldering
copper pads
polymer
transparent
ultrawideband (UWB)
Issue Date2010
PublisherIEEE.
Citation
Ieee Antennas And Wireless Propagation Letters, 2010, v. 9, p. 918-921 How to Cite?
AbstractA novel technique and a nonthermal soldering method to improve the performance of AgHT-8 transparent polymer antennas are proposed in this letter. The proposed technique involves the removal of the coating layer at areas on the coplanar waveguide (CPW) ground and feed line where the connectors of the coaxial feed or legs of the SMA connectors will be attached and applying a coat of silver paint on the exposed areas before cold-soldering the coaxial connections or SMA connector legs. The nonthermal or cold soldering using electrically conductive paste enables direct soldering of the coaxial feed points or connector legs, which cannot otherwise be done with hot or thermal soldering. This type of connection greatly enhances the performance of the AgHT-8 polymer antennas compared to coaxial feed point connections through hot-soldered copper pads glued to the surface of the polymer coating. The proposed technique also gives a stronger connection bond than directly cold-soldering the feed points or connectors to the smooth surface of the AgHT-8 material. Furthermore, the copper pad connection technique also introduces additional losses contributed by the adhesive properties of the glue used. This proposed novel technique and soldering method may be extended to enhance antenna performance made from other similar transparent conductive polymers like ITO. © 2010 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/139288
ISSN
2015 Impact Factor: 1.751
2015 SCImago Journal Rankings: 1.901
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorPeter, Ten_HK
dc.contributor.authorNilavalan, Ren_HK
dc.contributor.authorAbutarboush, HFen_HK
dc.contributor.authorCheung, SWen_HK
dc.date.accessioned2011-09-23T05:47:57Z-
dc.date.available2011-09-23T05:47:57Z-
dc.date.issued2010en_HK
dc.identifier.citationIeee Antennas And Wireless Propagation Letters, 2010, v. 9, p. 918-921en_HK
dc.identifier.issn1536-1225en_HK
dc.identifier.urihttp://hdl.handle.net/10722/139288-
dc.description.abstractA novel technique and a nonthermal soldering method to improve the performance of AgHT-8 transparent polymer antennas are proposed in this letter. The proposed technique involves the removal of the coating layer at areas on the coplanar waveguide (CPW) ground and feed line where the connectors of the coaxial feed or legs of the SMA connectors will be attached and applying a coat of silver paint on the exposed areas before cold-soldering the coaxial connections or SMA connector legs. The nonthermal or cold soldering using electrically conductive paste enables direct soldering of the coaxial feed points or connector legs, which cannot otherwise be done with hot or thermal soldering. This type of connection greatly enhances the performance of the AgHT-8 polymer antennas compared to coaxial feed point connections through hot-soldered copper pads glued to the surface of the polymer coating. The proposed technique also gives a stronger connection bond than directly cold-soldering the feed points or connectors to the smooth surface of the AgHT-8 material. Furthermore, the copper pad connection technique also introduces additional losses contributed by the adhesive properties of the glue used. This proposed novel technique and soldering method may be extended to enhance antenna performance made from other similar transparent conductive polymers like ITO. © 2010 IEEE.en_HK
dc.languageengen_US
dc.publisherIEEE.-
dc.relation.ispartofIEEE Antennas and Wireless Propagation Lettersen_HK
dc.rightsIEEE Antennas and Wireless Propagation Letters. Copyright © IEEE.-
dc.rights©2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.-
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.subjectCold solderingen_HK
dc.subjectcopper padsen_HK
dc.subjectpolymeren_HK
dc.subjecttransparenten_HK
dc.subjectultrawideband (UWB)en_HK
dc.titleA novel technique and soldering method to improve performance of transparent polymer antennasen_HK
dc.typeArticleen_HK
dc.identifier.emailCheung, SW:swcheung@eee.hku.hken_HK
dc.identifier.authorityCheung, SW=rp00102en_HK
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.1109/LAWP.2010.2077271en_HK
dc.identifier.scopuseid_2-s2.0-77957724224en_HK
dc.identifier.hkuros195878en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-77957724224&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume9en_HK
dc.identifier.spage918en_HK
dc.identifier.epage921en_HK
dc.identifier.isiWOS:000283372000006-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridPeter, T=36161443200en_HK
dc.identifier.scopusauthoridNilavalan, R=6603111339en_HK
dc.identifier.scopusauthoridAbutarboush, HF=26634701500en_HK
dc.identifier.scopusauthoridCheung, SW=7202472784en_HK

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