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Conference Paper: An analysis of a double-layer electromagnetic shield for a universal contactless battery charging platform

TitleAn analysis of a double-layer electromagnetic shield for a universal contactless battery charging platform
Authors
KeywordsCharging (Batteries)
Conductive Materials
Ferromagnetic Materials
Shielding
Transmission Line Theory
Issue Date2005
PublisherIEEE
Citation
Pesc Record - Ieee Annual Power Electronics Specialists Conference, 2005, v. 2005, p. 1767-1772 How to Cite?
AbstractA patented double-layer planar structure is employed to shield the electromagnetic (EM) field at the bottom of a universal charging platform. The double-layer consists of a layer of soft ferromagnetic material and a layer of conductive material. Thin 4F1 ferrite plate and the copper sheet are used in this example. This shielding technique is analyzed with the extended transmission line theory. With the formulas presented, the shielding effectiveness (SE) of both single-layer shield and double-layer shield could be calculated out directly, without using finite-element software. A classical transmitting-receiving loop measurement has been carried out to evaluate the SE of single ferrite shield, single copper shield and double-layer shield respectively. Calculated and measured results in the working frequency range of the charging platform from 100 kHz to 500 kHz confirm that the double-layer shield has obviously better SE than single-layer shield and can achieve a SE above 40dB, which is commonly accepted by the industry. Finally, the potential of this double-layer shielding technique for a wide range of power electronic applications is discussed. © 2005 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/136969
ISSN
2019 SCImago Journal Rankings: 0.125
References

 

DC FieldValueLanguage
dc.contributor.authorLiu, Xen_HK
dc.contributor.authorHui, SYRen_HK
dc.date.accessioned2011-07-29T02:13:52Z-
dc.date.available2011-07-29T02:13:52Z-
dc.date.issued2005en_HK
dc.identifier.citationPesc Record - Ieee Annual Power Electronics Specialists Conference, 2005, v. 2005, p. 1767-1772en_HK
dc.identifier.issn0275-9306en_HK
dc.identifier.urihttp://hdl.handle.net/10722/136969-
dc.description.abstractA patented double-layer planar structure is employed to shield the electromagnetic (EM) field at the bottom of a universal charging platform. The double-layer consists of a layer of soft ferromagnetic material and a layer of conductive material. Thin 4F1 ferrite plate and the copper sheet are used in this example. This shielding technique is analyzed with the extended transmission line theory. With the formulas presented, the shielding effectiveness (SE) of both single-layer shield and double-layer shield could be calculated out directly, without using finite-element software. A classical transmitting-receiving loop measurement has been carried out to evaluate the SE of single ferrite shield, single copper shield and double-layer shield respectively. Calculated and measured results in the working frequency range of the charging platform from 100 kHz to 500 kHz confirm that the double-layer shield has obviously better SE than single-layer shield and can achieve a SE above 40dB, which is commonly accepted by the industry. Finally, the potential of this double-layer shielding technique for a wide range of power electronic applications is discussed. © 2005 IEEE.en_HK
dc.languageengen_US
dc.publisherIEEEen_US
dc.relation.ispartofPESC Record - IEEE Annual Power Electronics Specialists Conferenceen_HK
dc.subjectCharging (Batteries)en_US
dc.subjectConductive Materialsen_US
dc.subjectFerromagnetic Materialsen_US
dc.subjectShieldingen_US
dc.subjectTransmission Line Theoryen_US
dc.titleAn analysis of a double-layer electromagnetic shield for a universal contactless battery charging platformen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailHui, SYR:ronhui@eee.hku.hken_HK
dc.identifier.authorityHui, SYR=rp01510en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/PESC.2005.1581870en_HK
dc.identifier.scopuseid_2-s2.0-33847691841en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33847691841&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume2005en_HK
dc.identifier.spage1767en_HK
dc.identifier.epage1772en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridLiu, X=53872841800en_HK
dc.identifier.scopusauthoridHui, SYR=7202831744en_HK
dc.identifier.issnl0275-9306-

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