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Article: Extended theory on the inductance calculation of planar spiral windings including the effectof double-layer electromagnetic shield

TitleExtended theory on the inductance calculation of planar spiral windings including the effectof double-layer electromagnetic shield
Authors
KeywordsDouble-layer shield
Impedance formulas
Planar spiral inductance
Issue Date2008
PublisherIEEE
Citation
Ieee Transactions On Power Electronics, 2008, v. 23 n. 4, p. 2052-2061 How to Cite?
AbstractRecent progress on wireless planar battery charging platform highlights a requirement that the platform must be shielded underneath so that the electromagnetic (EM) flux will not leak through the bottom of the charging platform. The presence of the EM shield will inevitably alter the flux distribution and thus the inductance of the planar windings. In this paper, a theory of inductance calculation of spiral windings is extended to determine the inductance of planar spiral windings shielded by a double-layer planar EM shield which consists of a layer of soft magnetic material and a layer of conductive material. With the generalized equations, the impedance of the planar spiral windings on double-layer shielding substrate and the optimal thickness of shielding materials can be calculated accurately without using time-consuming finite-element method. Therefore, the influence of the double-layer electromagnetic shield on the inductance of the planar spiral windings can be analyzed. Simulations and measurements have been carried out for several shielding plates with different permeability, conductivity, and thickness. Both of the simulations and measurements of the winding inductance agree well with the extended theory. © 2008 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/136943
ISSN
2015 Impact Factor: 4.953
2015 SCImago Journal Rankings: 3.005
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorSu, YPen_HK
dc.contributor.authorLiu, Xen_HK
dc.contributor.authorHui, SYen_HK
dc.date.accessioned2011-07-29T02:13:41Z-
dc.date.available2011-07-29T02:13:41Z-
dc.date.issued2008en_HK
dc.identifier.citationIeee Transactions On Power Electronics, 2008, v. 23 n. 4, p. 2052-2061en_HK
dc.identifier.issn0885-8993en_HK
dc.identifier.urihttp://hdl.handle.net/10722/136943-
dc.description.abstractRecent progress on wireless planar battery charging platform highlights a requirement that the platform must be shielded underneath so that the electromagnetic (EM) flux will not leak through the bottom of the charging platform. The presence of the EM shield will inevitably alter the flux distribution and thus the inductance of the planar windings. In this paper, a theory of inductance calculation of spiral windings is extended to determine the inductance of planar spiral windings shielded by a double-layer planar EM shield which consists of a layer of soft magnetic material and a layer of conductive material. With the generalized equations, the impedance of the planar spiral windings on double-layer shielding substrate and the optimal thickness of shielding materials can be calculated accurately without using time-consuming finite-element method. Therefore, the influence of the double-layer electromagnetic shield on the inductance of the planar spiral windings can be analyzed. Simulations and measurements have been carried out for several shielding plates with different permeability, conductivity, and thickness. Both of the simulations and measurements of the winding inductance agree well with the extended theory. © 2008 IEEE.en_HK
dc.languageengen_US
dc.publisherIEEEen_US
dc.relation.ispartofIEEE Transactions on Power Electronicsen_HK
dc.subjectDouble-layer shielden_HK
dc.subjectImpedance formulasen_HK
dc.subjectPlanar spiral inductanceen_HK
dc.titleExtended theory on the inductance calculation of planar spiral windings including the effectof double-layer electromagnetic shielden_HK
dc.typeArticleen_HK
dc.identifier.emailHui, SY:ronhui@eee.hku.hken_HK
dc.identifier.authorityHui, SY=rp01510en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/TPEL.2008.924824en_HK
dc.identifier.scopuseid_2-s2.0-47249102134en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-47249102134&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume23en_HK
dc.identifier.issue4en_HK
dc.identifier.spage2052en_HK
dc.identifier.epage2061en_HK
dc.identifier.isiWOS:000258118000047-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridSu, YP=24468926200en_HK
dc.identifier.scopusauthoridLiu, X=26660242800en_HK
dc.identifier.scopusauthoridHui, SY=7202831744en_HK

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