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Article: Improved TLM link model for reactive circuit components

TitleImproved TLM link model for reactive circuit components
Authors
KeywordsCircuit simulation
Link model
Stub model
Transmission line model
Issue Date1996
Citation
Iee Proceedings: Science, Measurement And Technology, 1996, v. 143 n. 5, p. 341-344 How to Cite?
AbstractAn improved transmission line modelling (TLM) link model for reactive circuit components is presented. This improved model reduces the propagation delay error in the conventional TLM link model. Consequently the improved model provides significant improvement in accuracy over the conventional link model. Simulation confirms that results obtained from the improved link model are much more accurate than those from the conventional link model. The simulation results also indicate that the improved link model is as accurate as the stub model. © IEE, 1996.
Persistent Identifierhttp://hdl.handle.net/10722/136899
ISSN
2008 Impact Factor: 0.784
References

 

DC FieldValueLanguage
dc.contributor.authorFung, KKen_HK
dc.contributor.authorHui, SYRen_HK
dc.date.accessioned2011-07-29T02:13:24Z-
dc.date.available2011-07-29T02:13:24Z-
dc.date.issued1996en_HK
dc.identifier.citationIee Proceedings: Science, Measurement And Technology, 1996, v. 143 n. 5, p. 341-344en_HK
dc.identifier.issn1350-2344en_HK
dc.identifier.urihttp://hdl.handle.net/10722/136899-
dc.description.abstractAn improved transmission line modelling (TLM) link model for reactive circuit components is presented. This improved model reduces the propagation delay error in the conventional TLM link model. Consequently the improved model provides significant improvement in accuracy over the conventional link model. Simulation confirms that results obtained from the improved link model are much more accurate than those from the conventional link model. The simulation results also indicate that the improved link model is as accurate as the stub model. © IEE, 1996.en_HK
dc.languageengen_US
dc.relation.ispartofIEE Proceedings: Science, Measurement and Technologyen_HK
dc.subjectCircuit simulationen_HK
dc.subjectLink modelen_HK
dc.subjectStub modelen_HK
dc.subjectTransmission line modelen_HK
dc.titleImproved TLM link model for reactive circuit componentsen_HK
dc.typeArticleen_HK
dc.identifier.emailHui, SYR:ronhui@eee.hku.hken_HK
dc.identifier.authorityHui, SYR=rp01510en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0030235190en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0030235190&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume143en_HK
dc.identifier.issue5en_HK
dc.identifier.spage341en_HK
dc.identifier.epage344en_HK
dc.identifier.scopusauthoridFung, KK=7202934759en_HK
dc.identifier.scopusauthoridHui, SYR=7202831744en_HK

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