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- Publisher Website: 10.1166/nnl.2011.1157
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Article: Temperature dependence of resistive switching in aluminum/anodized aluminum film structure
Title | Temperature dependence of resistive switching in aluminum/anodized aluminum film structure |
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Authors | |
Keywords | Anodized Aluminum Thin Film Current Transport Resistance Random Access Memory Resistive Switching Temperature Dependence |
Issue Date | 2011 |
Publisher | American Scientific Publishers. The Journal's web site is located at http://www.aspbs.com/nnl/ |
Citation | Nanoscience And Nanotechnology Letters, 2011, v. 3 n. 2, p. 222-225 How to Cite? |
Abstract | Resistive switching in anodized aluminum thin film structure and its temperature dependence have been studied in this work. A lower reset voltage (V reset)/set voltage (V set) was observed at an elevated temperature, suggesting that the conductive filaments were formed or ruptured more easily at a higher temperature. The carrier transport mechanisms were examined also. At low fields ( |
Persistent Identifier | http://hdl.handle.net/10722/133646 |
ISSN | 2019 Impact Factor: 1.128 2019 SCImago Journal Rankings: 0.173 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
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dc.contributor.author | Zhu, W | en_HK |
dc.contributor.author | Chen, TP | en_HK |
dc.contributor.author | Yang, M | en_HK |
dc.contributor.author | Liu, Y | en_HK |
dc.contributor.author | Fung, S | en_HK |
dc.date.accessioned | 2011-05-24T02:13:14Z | - |
dc.date.available | 2011-05-24T02:13:14Z | - |
dc.date.issued | 2011 | en_HK |
dc.identifier.citation | Nanoscience And Nanotechnology Letters, 2011, v. 3 n. 2, p. 222-225 | en_HK |
dc.identifier.issn | 1941-4900 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/133646 | - |
dc.description.abstract | Resistive switching in anodized aluminum thin film structure and its temperature dependence have been studied in this work. A lower reset voltage (V reset)/set voltage (V set) was observed at an elevated temperature, suggesting that the conductive filaments were formed or ruptured more easily at a higher temperature. The carrier transport mechanisms were examined also. At low fields (<V reset), both the low-resistance state (LRS) and high-resistance state (HRS) showed ohmic conduction at both room temperature and elevated temperatures up to 100 °C. The ohmic conduction of the LRS is due to the metallic conduction paths formed by the high concentration of aluminum inside the dielectric layer, while the ohmic conduction of the HRS is attributed to the hopping of thermally excited electrons from one isolated state to the next. At high fields (>V reset), other conduction mechanisms including the Schottky emission and the Poole-Frenkel emission were involved in the current conduction. Copyright © 2011 American Scientific Publishers. | en_HK |
dc.language | eng | en_US |
dc.publisher | American Scientific Publishers. The Journal's web site is located at http://www.aspbs.com/nnl/ | en_HK |
dc.relation.ispartof | Nanoscience and Nanotechnology Letters | en_HK |
dc.subject | Anodized Aluminum Thin Film | en_HK |
dc.subject | Current Transport | en_HK |
dc.subject | Resistance Random Access Memory | en_HK |
dc.subject | Resistive Switching | en_HK |
dc.subject | Temperature Dependence | en_HK |
dc.title | Temperature dependence of resistive switching in aluminum/anodized aluminum film structure | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1941-4900&volume=3&spage=222&epage=225&date=2011&atitle=Temperature+dependence+of+resistive+switching+in+aluminum/anodized+aluminum+film+structure | - |
dc.identifier.email | Fung, S: sfung@hku.hk | en_HK |
dc.identifier.authority | Fung, S=rp00695 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1166/nnl.2011.1157 | en_HK |
dc.identifier.scopus | eid_2-s2.0-79952714376 | en_HK |
dc.identifier.hkuros | 185383 | en_US |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-79952714376&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 3 | en_HK |
dc.identifier.issue | 2 | en_HK |
dc.identifier.spage | 222 | en_HK |
dc.identifier.epage | 225 | en_HK |
dc.identifier.isi | WOS:000293211300021 | - |
dc.publisher.place | United States | en_HK |
dc.identifier.scopusauthorid | Zhu, W=7404232937 | en_HK |
dc.identifier.scopusauthorid | Chen, TP=7405540443 | en_HK |
dc.identifier.scopusauthorid | Yang, M=24464683100 | en_HK |
dc.identifier.scopusauthorid | Liu, Y=36063639400 | en_HK |
dc.identifier.scopusauthorid | Fung, S=7201970040 | en_HK |
dc.identifier.issnl | 1941-4900 | - |