File Download
  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Dynamic adhesion energy between surfaces connected by molecular bonds and its application to peel test

TitleDynamic adhesion energy between surfaces connected by molecular bonds and its application to peel test
Authors
KeywordsAdhesion
Adhesion energy
Molecular bond
Peel test
Issue Date2010
PublisherSpringer New York LLC. The Journal's web site is located at http://www.springer.com/west/home/engineering/biomedical+eng?SGWID=4-194-70-173782016-detailsPage=journal
Citation
Cellular And Molecular Bioengineering, 2010, v. 3 n. 3, p. 247-255 How to Cite?
AbstractWe consider the energy needed to separate two surfaces connected by molecular bonds, whose formation and breakage can be described by the classical rate equation. We find that this adhesion energy is strongly rate-dependent due to the chemical kinetics involved. Two cases where the separation between surfaces grows linearly, or exponentially, with respect to time are studied in detail, scaling relations between the adhesion energy and separation speed, or the exponential factor, are derived in each case. As an example of application, the peel test of a membrane in adhesive contact with a substrate is also studied. We will show that findings obtained here can be directly used to predict the relationship between the applied tension and the peeling velocity, which is of central interest to this type of experiment. © 2010 Biomedical Engineering Society.
Persistent Identifierhttp://hdl.handle.net/10722/129256
ISSN
2015 Impact Factor: 1.589
2015 SCImago Journal Rankings: 0.758
ISI Accession Number ID
Funding AgencyGrant Number
University of Hong Kong200809159003
Funding Information:

Y. Lin wants to acknowledge the support by the Seed Funding Programme for Basic Research from The University of Hong Kong (Project No. 200809159003).

References

 

DC FieldValueLanguage
dc.contributor.authorLin, Yen_HK
dc.contributor.authorYao, Sen_HK
dc.contributor.authorXu, Qen_HK
dc.date.accessioned2010-12-23T08:34:19Z-
dc.date.available2010-12-23T08:34:19Z-
dc.date.issued2010en_HK
dc.identifier.citationCellular And Molecular Bioengineering, 2010, v. 3 n. 3, p. 247-255en_HK
dc.identifier.issn1865-5025en_HK
dc.identifier.urihttp://hdl.handle.net/10722/129256-
dc.description.abstractWe consider the energy needed to separate two surfaces connected by molecular bonds, whose formation and breakage can be described by the classical rate equation. We find that this adhesion energy is strongly rate-dependent due to the chemical kinetics involved. Two cases where the separation between surfaces grows linearly, or exponentially, with respect to time are studied in detail, scaling relations between the adhesion energy and separation speed, or the exponential factor, are derived in each case. As an example of application, the peel test of a membrane in adhesive contact with a substrate is also studied. We will show that findings obtained here can be directly used to predict the relationship between the applied tension and the peeling velocity, which is of central interest to this type of experiment. © 2010 Biomedical Engineering Society.en_HK
dc.languageengen_US
dc.publisherSpringer New York LLC. The Journal's web site is located at http://www.springer.com/west/home/engineering/biomedical+eng?SGWID=4-194-70-173782016-detailsPage=journalen_HK
dc.relation.ispartofCellular and Molecular Bioengineeringen_HK
dc.rightsThe original publication is available at www.springerlink.com-
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.subjectAdhesionen_HK
dc.subjectAdhesion energyen_HK
dc.subjectMolecular bonden_HK
dc.subjectPeel testen_HK
dc.titleDynamic adhesion energy between surfaces connected by molecular bonds and its application to peel testen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1865-5025&volume=3&issue=3&spage=247&epage=255&date=2010&atitle=Dynamic+adhesion+energy+between+surfaces+connected+by+molecular+bonds+and+its+application+to+peel+test-
dc.identifier.emailLin, Y:ylin@hku.hken_HK
dc.identifier.authorityLin, Y=rp00080en_HK
dc.description.naturepostprint-
dc.identifier.doi10.1007/s12195-010-0130-2en_HK
dc.identifier.scopuseid_2-s2.0-78651476045en_HK
dc.identifier.hkuros178152en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-78651476045&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume3en_HK
dc.identifier.issue3en_HK
dc.identifier.spage247en_HK
dc.identifier.epage255en_HK
dc.identifier.isiWOS:000280900300005-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridLin, Y=7406585339en_HK
dc.identifier.scopusauthoridYao, S=38562572400en_HK
dc.identifier.scopusauthoridXu, Q=55222785000en_HK
dc.identifier.citeulike7417130-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats