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Conference Paper: Multi-physics analysis methodologies for signal integrity

TitleMulti-physics analysis methodologies for signal integrity
Authors
Issue Date2010
PublisherIEEE - EMC Society.
Citation
The IEEE International Symposium on Electromagnetic Compatibility (ISEMC), Fort Lauderdale, FL., 25-30 July 2010. How to Cite?
AbstractThis tutorial discusses two mutli-physics problems involved in modern signal integrity technologies: (1) multi-physics issue related to frequencies: it provides fundamental insights about multi-scale problems and the general strategy in dealing with multi-scale simulations. (2) multi-physics thermal electrical coupling analysis for on-chip and packaging structures. Theoretical analysis and numerical benchmarks will both be employed in the tutorial.
DescriptionEMC 2010 – Workshops / Tutorials
Persistent Identifierhttp://hdl.handle.net/10722/126097

 

DC FieldValueLanguage
dc.contributor.authorJiang, Len_HK
dc.date.accessioned2010-10-31T12:09:38Z-
dc.date.available2010-10-31T12:09:38Z-
dc.date.issued2010en_HK
dc.identifier.citationThe IEEE International Symposium on Electromagnetic Compatibility (ISEMC), Fort Lauderdale, FL., 25-30 July 2010.en_HK
dc.identifier.urihttp://hdl.handle.net/10722/126097-
dc.descriptionEMC 2010 – Workshops / Tutorials-
dc.description.abstractThis tutorial discusses two mutli-physics problems involved in modern signal integrity technologies: (1) multi-physics issue related to frequencies: it provides fundamental insights about multi-scale problems and the general strategy in dealing with multi-scale simulations. (2) multi-physics thermal electrical coupling analysis for on-chip and packaging structures. Theoretical analysis and numerical benchmarks will both be employed in the tutorial.-
dc.languageengen_HK
dc.publisherIEEE - EMC Society.-
dc.relation.ispartofIEEE International Symposium on Electromagnetic Compatibility-
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.titleMulti-physics analysis methodologies for signal integrityen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailJiang, L: jianglj@hku.hk, ljiang@eee.hku.hken_HK
dc.identifier.authorityJiang, L=rp01338en_HK
dc.description.naturepostprint-
dc.identifier.hkuros182550en_HK
dc.description.otherThe IEEE International Symposium on Electromagnetic Compatibility (ISEMC), Fort Lauderdale, FL., 25-30 July 2010.-

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