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Conference Paper: Multi-physics analysis methodologies for signal integrity
| Title | Multi-physics analysis methodologies for signal integrity |
|---|---|
| Authors | |
| Issue Date | 2010 |
| Publisher | IEEE - EMC Society. |
| Citation | The IEEE International Symposium on Electromagnetic Compatibility (ISEMC), Fort Lauderdale, FL., 25-30 July 2010. How to Cite? |
| Abstract | This tutorial discusses two mutli-physics problems involved in modern signal integrity technologies: (1) multi-physics issue related to frequencies: it provides fundamental insights about multi-scale problems and the general strategy in dealing with multi-scale simulations. (2) multi-physics thermal electrical coupling analysis for on-chip and packaging structures. Theoretical analysis and numerical benchmarks will both be employed in the tutorial. |
| Description | EMC 2010 – Workshops / Tutorials |
| Persistent Identifier | http://hdl.handle.net/10722/126097 |
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jiang, L | en_HK |
| dc.date.accessioned | 2010-10-31T12:09:38Z | - |
| dc.date.available | 2010-10-31T12:09:38Z | - |
| dc.date.issued | 2010 | en_HK |
| dc.identifier.citation | The IEEE International Symposium on Electromagnetic Compatibility (ISEMC), Fort Lauderdale, FL., 25-30 July 2010. | en_HK |
| dc.identifier.uri | http://hdl.handle.net/10722/126097 | - |
| dc.description | EMC 2010 – Workshops / Tutorials | - |
| dc.description.abstract | This tutorial discusses two mutli-physics problems involved in modern signal integrity technologies: (1) multi-physics issue related to frequencies: it provides fundamental insights about multi-scale problems and the general strategy in dealing with multi-scale simulations. (2) multi-physics thermal electrical coupling analysis for on-chip and packaging structures. Theoretical analysis and numerical benchmarks will both be employed in the tutorial. | - |
| dc.language | eng | en_HK |
| dc.publisher | IEEE - EMC Society. | - |
| dc.relation.ispartof | IEEE International Symposium on Electromagnetic Compatibility | - |
| dc.title | Multi-physics analysis methodologies for signal integrity | en_HK |
| dc.type | Conference_Paper | en_HK |
| dc.identifier.email | Jiang, L: jianglj@hku.hk, ljiang@eee.hku.hk | en_HK |
| dc.identifier.authority | Jiang, L=rp01338 | en_HK |
| dc.description.nature | postprint | - |
| dc.identifier.hkuros | 182550 | en_HK |
| dc.description.other | The IEEE International Symposium on Electromagnetic Compatibility (ISEMC), Fort Lauderdale, FL., 25-30 July 2010. | - |