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Article: Experimental investigation of bubble formation in a microfluidic T-shaped junction

TitleExperimental investigation of bubble formation in a microfluidic T-shaped junction
Authors
KeywordsBubble
Fluid mechanics
Microfluidics
T-shaped junction
Visualization
Issue Date2009
PublisherTaylor & Francis Inc. The Journal's web site is located at http://www.tandf.co.uk/journals/titles/15567265.asp
Citation
Nanoscale And Microscale Thermophysical Engineering, 2009, v. 13 n. 4, p. 228-242 How to Cite?
AbstractWe have successfully fabricated a glass microfluidic device with a confined T-shaped junction in an ordinary laboratory without a clean room. In the microfluidic T-shaped junction, the bubble formation regime and the bubble volume generated were studied under different combinations of gas inlet pressure, liquid flow rate, liquid viscosity, and surface tension. It was found that both the minimum and the maximum gas inlet pressures for generating bubbles were larger than and proportional to the liquid pressure drop from the T-shaped junction to the channel outlet. The capillary number was found to have a significant influence on the bubble volume. An empirical relation is proposed to predict the bubble volume based on the capillary number and the liquid pressure drop from the T-shaped junction to the channel outlet.
Persistent Identifierhttp://hdl.handle.net/10722/124859
ISSN
2015 Impact Factor: 2.39
ISI Accession Number ID
Funding AgencyGrant Number
Research Grants Council of Hong KongGRF 718009
CRCG of the University of Hong Kong200707176111
200607176138
Funding Information:

Financial support from the Research Grants Council of Hong Kong (GRF 718009) and the CRCG of the University of Hong Kong (200707176111 and 200607176138) is gratefully acknowledged.

References

 

DC FieldValueLanguage
dc.contributor.authorZhang, Yen_HK
dc.contributor.authorWang, Len_HK
dc.date.accessioned2010-10-31T10:58:09Z-
dc.date.available2010-10-31T10:58:09Z-
dc.date.issued2009en_HK
dc.identifier.citationNanoscale And Microscale Thermophysical Engineering, 2009, v. 13 n. 4, p. 228-242en_HK
dc.identifier.issn1556-7265en_HK
dc.identifier.urihttp://hdl.handle.net/10722/124859-
dc.description.abstractWe have successfully fabricated a glass microfluidic device with a confined T-shaped junction in an ordinary laboratory without a clean room. In the microfluidic T-shaped junction, the bubble formation regime and the bubble volume generated were studied under different combinations of gas inlet pressure, liquid flow rate, liquid viscosity, and surface tension. It was found that both the minimum and the maximum gas inlet pressures for generating bubbles were larger than and proportional to the liquid pressure drop from the T-shaped junction to the channel outlet. The capillary number was found to have a significant influence on the bubble volume. An empirical relation is proposed to predict the bubble volume based on the capillary number and the liquid pressure drop from the T-shaped junction to the channel outlet.en_HK
dc.languageengen_HK
dc.publisherTaylor & Francis Inc. The Journal's web site is located at http://www.tandf.co.uk/journals/titles/15567265.aspen_HK
dc.relation.ispartofNanoscale and Microscale Thermophysical Engineeringen_HK
dc.subjectBubbleen_HK
dc.subjectFluid mechanicsen_HK
dc.subjectMicrofluidicsen_HK
dc.subjectT-shaped junctionen_HK
dc.subjectVisualizationen_HK
dc.titleExperimental investigation of bubble formation in a microfluidic T-shaped junctionen_HK
dc.typeArticleen_HK
dc.identifier.emailWang, L:lqwang@hkucc.hku.hken_HK
dc.identifier.authorityWang, L=rp00184en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1080/15567260903276999en_HK
dc.identifier.scopuseid_2-s2.0-70449350438en_HK
dc.identifier.hkuros174471en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-70449350438&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume13en_HK
dc.identifier.issue4en_HK
dc.identifier.spage228en_HK
dc.identifier.epage242en_HK
dc.identifier.isiWOS:000274752800003-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridZhang, Y=35118410200en_HK
dc.identifier.scopusauthoridWang, L=35235288500en_HK

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