Conference Paper: Down-The-Hole (DTH) Drill in Soil Nailing Technology in Hong Kong

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TitleDown-The-Hole (DTH) Drill in Soil Nailing Technology in Hong Kong
AuthorsSugawara, J
Li, A
Yue, QZQ
Tham, LG
Law, KT
Lee, CF
Issue Date2004
CitationInternational Conference on Soil Nailing & Stability of Soil and Rock Engineering, 21-22 October, Nanjing, China, p. 173 [How to Cite?]
DC Field
Value
dc.contributor.authorSugawara, J
dc.contributor.authorLi, A
dc.contributor.authorYue, QZQ
dc.contributor.authorTham, LG
dc.contributor.authorLaw, KT
dc.contributor.authorLee, CF
dc.date.accessioned2010-09-26T02:27:42Z
dc.date.available2010-09-26T02:27:42Z
dc.date.issued2004
dc.identifier.citationInternational Conference on Soil Nailing & Stability of Soil and Rock Engineering, 21-22 October, Nanjing, China, p. 173 [How to Cite?]
dc.identifier.hkuros96574
dc.identifier.spage173
dc.identifier.urihttp://hdl.handle.net/10722/110940
dc.languageeng
dc.relation.ispartofInternational Conference on Soil Nailing & Stability of Soil and Rock Engineering, 21-22 October, Nanjing, China
dc.titleDown-The-Hole (DTH) Drill in Soil Nailing Technology in Hong Kong
dc.typeConference_Paper