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Conference Paper: Down-The-Hole (DTH) Drill in Soil Nailing Technology in Hong Kong

TitleDown-The-Hole (DTH) Drill in Soil Nailing Technology in Hong Kong
Authors
Sugawara, JLi, AYue, QZQTham, LGLaw, KTLee, CF
Issue Date2004
Citation
International Conference on Soil Nailing & Stability of Soil and Rock Engineering, 21-22 October, Nanjing, China, p. 173 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/110940

 

DC FieldValueLanguage
dc.contributor.authorSugawara, Jen_HK
dc.contributor.authorLi, Aen_HK
dc.contributor.authorYue, QZQen_HK
dc.contributor.authorTham, LGen_HK
dc.contributor.authorLaw, KTen_HK
dc.contributor.authorLee, CFen_HK
dc.date.accessioned2010-09-26T02:27:42Z-
dc.date.available2010-09-26T02:27:42Z-
dc.date.issued2004en_HK
dc.identifier.citationInternational Conference on Soil Nailing & Stability of Soil and Rock Engineering, 21-22 October, Nanjing, China, p. 173en_HK
dc.identifier.urihttp://hdl.handle.net/10722/110940-
dc.languageengen_HK
dc.relation.ispartofInternational Conference on Soil Nailing & Stability of Soil and Rock Engineering, 21-22 October, Nanjing, Chinaen_HK
dc.titleDown-The-Hole (DTH) Drill in Soil Nailing Technology in Hong Kongen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailYue, QZQ: yueqzq@hkucc.hku.hken_HK
dc.identifier.emailTham, LG: hrectlg@hkucc.hku.hken_HK
dc.identifier.emailLee, CF: leecf@hkucc.hku.hken_HK
dc.identifier.authorityYue, QZQ=rp00209en_HK
dc.identifier.authorityTham, LG=rp00176en_HK
dc.identifier.authorityLee, CF=rp00139en_HK
dc.identifier.hkuros96574en_HK
dc.identifier.spage173en_HK

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