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Conference Paper: Parametric Analysis of Soil Nail Design for Cut Slopes

TitleParametric Analysis of Soil Nail Design for Cut Slopes
Authors
Yue, QZQTham, LGLee, CF
Issue Date2003
Citation
Proceedings of the International Conference on Slope Engineering, Hong Kong, China, p. 554-560 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/110747

 

DC FieldValueLanguage
dc.contributor.authorYue, QZQen_HK
dc.contributor.authorTham, LGen_HK
dc.contributor.authorLee, CFen_HK
dc.date.accessioned2010-09-26T02:19:24Z-
dc.date.available2010-09-26T02:19:24Z-
dc.date.issued2003en_HK
dc.identifier.citationProceedings of the International Conference on Slope Engineering, Hong Kong, China, p. 554-560en_HK
dc.identifier.urihttp://hdl.handle.net/10722/110747-
dc.languageengen_HK
dc.relation.ispartofProceedings of the International Conference on Slope Engineering, Hong Kong, Chinaen_HK
dc.titleParametric Analysis of Soil Nail Design for Cut Slopesen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailYue, QZQ: yueqzq@hkucc.hku.hken_HK
dc.identifier.emailTham, LG: hrectlg@hkucc.hku.hken_HK
dc.identifier.emailLee, CF: leecf@hkucc.hku.hken_HK
dc.identifier.authorityYue, QZQ=rp00209en_HK
dc.identifier.authorityTham, LG=rp00176en_HK
dc.identifier.authorityLee, CF=rp00139en_HK
dc.identifier.hkuros85653en_HK
dc.identifier.spage554en_HK
dc.identifier.epage560en_HK

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