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Conference Paper: Dynamic studies on Cu-based shape memory alloy using positron lifetime spectroscopy

TitleDynamic studies on Cu-based shape memory alloy using positron lifetime spectroscopy
Authors
KeywordsDefect
Martensitic Transformation
Positron Lifetime
Shape Memory Alloy
Issue Date1997
PublisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net
Citation
Materials Science Forum, 1997, v. 255-257, p. 454-456 How to Cite?
AbstractThis paper describes a positron lifetime study of properties and dynamic behavior of vacancies in CuZnAlMnZr alloy during aging at room temperature (RT) after Direct- and Step-quenching. It is found that there is only one type of vacancy in CuZnAlMnZr which has no effect on the shape memory properties of CuZnAlMnZr and the vacancy recovery process is quite slow after Direct-quenching and no recovery process after Step-quenching, and the CuZnAlMnZr alloy has better thermal stability than the ordinary CuZnAl alloy. During the long measurement period, a software stabilization technique has been adopted and the reliability of the software has been checked.
Persistent Identifierhttp://hdl.handle.net/10722/109741
ISSN
2005 Impact Factor: 0.399
References

 

DC FieldValueLanguage
dc.contributor.authorHuang, APen_HK
dc.contributor.authorLing, CCen_HK
dc.contributor.authorFung, Sen_HK
dc.contributor.authorBeling, CDen_HK
dc.contributor.authorLam, CWHen_HK
dc.contributor.authorChung, CYen_HK
dc.date.accessioned2010-09-26T01:35:15Z-
dc.date.available2010-09-26T01:35:15Z-
dc.date.issued1997en_HK
dc.identifier.citationMaterials Science Forum, 1997, v. 255-257, p. 454-456en_HK
dc.identifier.issn0255-5476en_HK
dc.identifier.urihttp://hdl.handle.net/10722/109741-
dc.description.abstractThis paper describes a positron lifetime study of properties and dynamic behavior of vacancies in CuZnAlMnZr alloy during aging at room temperature (RT) after Direct- and Step-quenching. It is found that there is only one type of vacancy in CuZnAlMnZr which has no effect on the shape memory properties of CuZnAlMnZr and the vacancy recovery process is quite slow after Direct-quenching and no recovery process after Step-quenching, and the CuZnAlMnZr alloy has better thermal stability than the ordinary CuZnAl alloy. During the long measurement period, a software stabilization technique has been adopted and the reliability of the software has been checked.en_HK
dc.languageengen_HK
dc.publisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.neten_HK
dc.relation.ispartofMaterials Science Forumen_HK
dc.rightsMaterials Science Forum. Copyright © Trans Tech Publications Ltd.en_HK
dc.subjectDefecten_HK
dc.subjectMartensitic Transformationen_HK
dc.subjectPositron Lifetimeen_HK
dc.subjectShape Memory Alloyen_HK
dc.titleDynamic studies on Cu-based shape memory alloy using positron lifetime spectroscopyen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0255-5476&volume=255-257&spage=454&epage=456&date=1997&atitle=Dynamic+Studies+on+Cu-Based+Shape+Memory+Alloy+Using+Positron+Lifetime+Spectroscopyen_HK
dc.identifier.emailLing, CC: ccling@hkucc.hku.hken_HK
dc.identifier.emailFung, S: sfung@hku.hken_HK
dc.identifier.emailBeling, CD: cdbeling@hkucc.hku.hken_HK
dc.identifier.authorityLing, CC=rp00747en_HK
dc.identifier.authorityFung, S=rp00695en_HK
dc.identifier.authorityBeling, CD=rp00660en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-5244311955en_HK
dc.identifier.hkuros29700en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-5244311955&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume255-257en_HK
dc.identifier.spage454en_HK
dc.identifier.epage456en_HK
dc.publisher.placeSwitzerlanden_HK
dc.identifier.scopusauthoridHuang, AP=7402307122en_HK
dc.identifier.scopusauthoridLing, CC=13310239300en_HK
dc.identifier.scopusauthoridFung, S=7201970040en_HK
dc.identifier.scopusauthoridBeling, CD=7005864180en_HK
dc.identifier.scopusauthoridLam, CWH=8531362100en_HK
dc.identifier.scopusauthoridChung, CY=8100842800en_HK

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