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Conference Paper: Biomechanical properties of absorbable implants in finger fractures

TitleBiomechanical properties of absorbable implants in finger fractures
Authors
Fitoussi, FLu, WWIp, JWYChow, SP
Issue Date1998
Citation
The 1st International Congress of the Hong Kong Academy of Medicine (HKAM 1998), Hong Kong, 26-29 November 1998. How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/103750

 

DC FieldValueLanguage
dc.contributor.authorFitoussi, F-
dc.contributor.authorLu, WW-
dc.contributor.authorIp, JWY-
dc.contributor.authorChow, SP-
dc.date.accessioned2010-09-25T21:25:10Z-
dc.date.available2010-09-25T21:25:10Z-
dc.date.issued1998-
dc.identifier.citationThe 1st International Congress of the Hong Kong Academy of Medicine (HKAM 1998), Hong Kong, 26-29 November 1998.-
dc.identifier.urihttp://hdl.handle.net/10722/103750-
dc.languageeng-
dc.relation.ispartof1st International Congress of the Hong Kong Academy of Medicine, HKAM 1998-
dc.titleBiomechanical properties of absorbable implants in finger fractures-
dc.typeConference_Paper-
dc.identifier.emailLu, WW: wwlu@hku.hk-
dc.identifier.emailIp, JWY: wyip@hku.hk-
dc.identifier.emailChow, SP: spchow@hku.hk-
dc.identifier.authorityLu, WW=rp00411-
dc.identifier.authorityIp, JWY=rp00401-
dc.identifier.authorityChow, SP=rp00064-
dc.identifier.hkuros41850-

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