File Download

There are no files associated with this item.

Supplementary

Conference Paper: Investigation of pile-up effects at grain boundaries in undoped and boron-doped Ni3Al using nanoindentation

TitleInvestigation of pile-up effects at grain boundaries in undoped and boron-doped Ni3Al using nanoindentation
Authors
Wo, PCNgan, AHW
Issue Date2003
PublisherPalexo Congress Center.
Citation
9th International Conference on the Mechanical Behaviour of Materials (ICM9), CD-ROM Proceedings, p. Paper no. 149 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/100893

 

DC FieldValueLanguage
dc.contributor.authorWo, PCen_HK
dc.contributor.authorNgan, AHWen_HK
dc.date.accessioned2010-09-25T19:27:39Z-
dc.date.available2010-09-25T19:27:39Z-
dc.date.issued2003en_HK
dc.identifier.citation9th International Conference on the Mechanical Behaviour of Materials (ICM9), CD-ROM Proceedings, p. Paper no. 149en_HK
dc.identifier.urihttp://hdl.handle.net/10722/100893-
dc.languageengen_HK
dc.publisherPalexo Congress Center.en_HK
dc.relation.ispartof9th International Conference on the Mechanical Behaviour of Materials (ICM9)en_HK
dc.titleInvestigation of pile-up effects at grain boundaries in undoped and boron-doped Ni3Al using nanoindentationen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailNgan, AHW: hwngan@hkucc.hku.hken_HK
dc.identifier.authorityNgan, AHW=rp00225en_HK
dc.identifier.hkuros88658en_HK
dc.identifier.volume, CD-ROM Proceedingsen_HK

Export via OAI-PMH Interface in XML Formats

OR

Export to Other Non-XML Formats