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Conference Paper: Thermoforming mould design using a reverse engineering approach
Title | Thermoforming mould design using a reverse engineering approach |
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Authors | |
Issue Date | 2005 |
Publisher | Centre for Advanced Manufacturing Research. |
Citation | Proceedings of the International Manufacturing Leaders Forum on 'Global Competitive Manufacturing' 2005, CD-ROM, p. 8pp How to Cite? |
Persistent Identifier | http://hdl.handle.net/10722/100602 |
DC Field | Value | Language |
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dc.contributor.author | Tam, KW | en_HK |
dc.contributor.author | Chan, KW | en_HK |
dc.date.accessioned | 2010-09-25T19:16:24Z | - |
dc.date.available | 2010-09-25T19:16:24Z | - |
dc.date.issued | 2005 | en_HK |
dc.identifier.citation | Proceedings of the International Manufacturing Leaders Forum on 'Global Competitive Manufacturing' 2005, CD-ROM, p. 8pp | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/100602 | - |
dc.language | eng | en_HK |
dc.publisher | Centre for Advanced Manufacturing Research. | en_HK |
dc.relation.ispartof | Proceedings of the International Manufacturing Leaders Forum on 'Global Competitive Manufacturing' 2005 | en_HK |
dc.title | Thermoforming mould design using a reverse engineering approach | en_HK |
dc.type | Conference_Paper | en_HK |
dc.identifier.email | Chan, KW: akwchan@hkucc.hku.hk | en_HK |
dc.identifier.authority | Chan, KW=rp00079 | en_HK |
dc.identifier.hkuros | 100219 | en_HK |
dc.identifier.volume | , CD-ROM | en_HK |
dc.identifier.spage | 8 | en_HK |