Results 1 to 19 of 19
Page 1 of 1
TypeTitleAuthor(s)YearViews
Height inspection of wafer bumps without explicit 3-D reconstruction
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
Dong, M; Chung, R; Lam, EY; Fung, KSM2010116
 
Reference-free machine vision inspection of semiconductor die images
Journal:
International Journal of Image and Graphics
Publisher:
World Scientific Publishing Co Pte Ltd. The Journal's web site is located at http://www.worldscinet.com/ijig/ijig.shtml
Ng, A; Lam, EYM; Chung, R; Fung, K; Leung, W2009472
 
Erratum: Projection optics design for tilted projection of fringe patterns (Optical Engineering (2008) 47 (053002))
Journal:
Optical Engineering
Publisher:
S P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/oe
Shu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F2008116
 
Projection optics design for tilted projection of fringe patterns
Journal:
Optical Engineering
Publisher:
S P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/oe
Shu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F2008343
 
Handling of multi-reflections in wafer bump 3D reconstruction
Proceedings/Conference:
Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics
Cheng, J; Chung, R; Lam, EY; Fung, KSM2008223
 
Use of paraplanar constraint for parallel inspection of wafer bump heights
Proceedings/Conference:
International Conference on Image Processing, Computer Vision, and Pattern Recognition
Dong, M; Chung, R; Lam, EYM; Fung, SM2007188
 
Optimization of bit-pairing codification with learning for 3D reconstruction
Journal:
International Journal of Image and Graphics
Publisher:
World Scientific Publishing Co Pte Ltd. The Journal's web site is located at http://www.worldscinet.com/ijig/ijig.shtml
Cheng, J; Chung, R; Lam, EYM; Fung, SM; Xu, Y2007253
 
Boundary detection of projected fringes on surface with inhomogeneous reflectance function
Proceedings/Conference:
Machine Vision Applications in Industrial Inspection
Cheng, J; Chung, R; Lam, EYM; Fung, K; Wang, F; Leung, WH2006152
 
A novel design of grating projecting system for 3D reconstruction of wafer bumps
Proceedings/Conference:
Three-Dimensional Image Capture and Applications
Shu, Y; Chung, R; Cheng, J; Lam, EYM2006193
 
Structured light-based 3D reconstruction for device with a tiny size
Proceedings/Conference:
European Conference on Computer Vision's 2nd Workshop on Applications of Computer Vision
Cheng, J; Chung, R; Lam, EYM2006122
 
Height inspection of wafer bumps without explicit 3D reconstruction
Proceedings/Conference:
Machine Vision Applications in Industrial Inspection
Dong, M; Chung, R; Zhao, Y; Lam, EYM2006121
 
Height inspection of wafer bumps without explicit 3D reconstruction
Proceedings/Conference:
Proceedings of SPIE - The International Society for Optical Engineering
Publisher:
S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Dong, M; Chung, R; Zhao, Y; Lam, EY2006248
 
Bit-pairing codification for binary pattern projection system
Proceedings/Conference:
Proceedings - International Conference on Pattern Recognition
Publisher:
IEEE, Computer Society.
Cheng, J; Chung, R; Lam, EY; Fung, KSM2006444
 
Surface orientation recovery of specular micro-surface via binary pattern projection
Proceedings/Conference:
Proceedings of SPIE - The International Society for Optical Engineering
Publisher:
S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Song, Z; Chung, R; Cheng, J; Lam, EY2006140
 
Boundary detection of projected fringes on surface with inhomogeneous reflectance function
Proceedings/Conference:
Proceedings of SPIE - The International Society for Optical Engineering
Publisher:
S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Cheng, J; Chung, R; Lam, EY; Fung, KSM; Wang, F; Leung, WH2006116
 
A novel design of grating projection system for 3D reconstruction of wafer bumps
Proceedings/Conference:
Proceedings of SPIE - The International Society for Optical Engineering
Publisher:
S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Shu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F2006209
 
Automatic Segmentation For Visual Inspection In Semiconductor Manufacturing Using Multiscale Morphology
Proceedings/Conference:
7th International Conference on Quality Control by Artificial Vision
Ng, NY; Lam, EYM; Chung, R; Fung, KSM; Leung, WH2005168
 
Reference-free detection of semiconductor assembly defect
Proceedings/Conference:
Proceedings of SPIE - The International Society for Optical Engineering
Publisher:
S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Ng, ANY; Lam, EY; Chung, R; Fung, KSM; Leung, WH2005746
 
Three-dimensional reconstruction of wafer solder bumps using binary pattern projection
Proceedings/Conference:
Proceedings of SPIE - The International Society for Optical Engineering
Publisher:
S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Cheng, J; Chung, R; Lam, EY; Fung, KSM; Wang, F; Leung, WH2005766
 
Page 1 of 1
Export Records
Step 1: Select content and export format
  • Citation only
Step 2: Select export method
  • Download