Browsing by Author Chung, R

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Showing results 1 to 19 of 19
TitleAuthor(s)Issue DateViews
 
Automatic Segmentation For Visual Inspection In Semiconductor Manufacturing Using Multiscale Morphology
Proceeding/Conference:7th International Conference on Quality Control by Artificial Vision
2005
192
 
Bit-pairing codification for binary pattern projection system
Proceeding/Conference:Proceedings - International Conference on Pattern Recognition
2006
472
Boundary detection of projected fringes on surface with inhomogeneous reflectance function
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
157
 
Boundary detection of projected fringes on surface with inhomogeneous reflectance function
Proceeding/Conference:Machine Vision Applications in Industrial Inspection
2006
194
 
2008
157
Handling of multi-reflections in wafer bump 3D reconstruction
Proceeding/Conference:Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics
2008
267
 
Height inspection of wafer bumps without explicit 3-D reconstruction
Journal:IEEE Transactions on Electronics Packaging Manufacturing
2010
158
 
Height inspection of wafer bumps without explicit 3D reconstruction
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
280
 
Height inspection of wafer bumps without explicit 3D reconstruction
Proceeding/Conference:Machine Vision Applications in Industrial Inspection
2006
136
 
A novel design of grating projecting system for 3D reconstruction of wafer bumps
Proceeding/Conference:Three-Dimensional Image Capture and Applications
2006
228
A novel design of grating projection system for 3D reconstruction of wafer bumps
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
243
 
Optimization of bit-pairing codification with learning for 3D reconstruction
Journal:International Journal of Image and Graphics
2007
274
 
2008
379
 
Reference-free detection of semiconductor assembly defect
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2005
776
 
Reference-free machine vision inspection of semiconductor die images
Journal:International Journal of Image and Graphics
2009
501
 
Structured light-based 3D reconstruction for device with a tiny size
Proceeding/Conference:European Conference on Computer Vision's 2nd Workshop on Applications of Computer Vision
2006
137
Surface orientation recovery of specular micro-surface via binary pattern projection
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
175
 
Three-dimensional reconstruction of wafer solder bumps using binary pattern projection
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2005
802
 
Use of paraplanar constraint for parallel inspection of wafer bump heights
Proceeding/Conference:International Conference on Image Processing, Computer Vision, and Pattern Recognition
2007
222