Browsing by Author Rubin, BJ

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Showing results 7 to 12 of 12 < previous 
TitleAuthor(s)Issue DateViews
 
On the dual basis for solving electromagnetic surface integral equations
Journal:IEEE Transactions on Antennas and Propagation
2009
81
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP
2008
69
 
2010
61
2007
67
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging
2005
68
The use of fast integral equations solvers for practical package and interconnect analysis
Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP
2006
70