Showing results 2 to 6 of 6
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Title | Author(s) | Issue Date | |
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Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer Proceeding/Conference:Proceedings - Electronic Components and Technology Conference | 2008 | ||
Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2006 | ||
On the dual basis for solving electromagnetic surface integral equations Journal:IEEE Transactions on Antennas and Propagation | 2009 | ||
Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging | 2007 | ||
The use of fast integral equations solvers for practical package and interconnect analysis Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2006 |