Showing results 20 to 21 of 21
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| Title | Author(s) | Issue Date | Views | |
|---|---|---|---|---|
A three-dimensional imaging system for surface profilometry of moving objects Proceeding/Conference:IEEE International Workshop on Imaging Systems and Techniques Proceedings | 2013 | 44 | ||
Three-dimensional reconstruction of wafer solder bumps using binary pattern projection Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2005 | 80 |