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Showing results 5 to 11 of 11 < previous

	Title	Author(s)	Issue Date	Views
	Interconnect performance and scaling strategy for the 22 nm node and beyond Proceeding/Conference:Advanced Metallization Conference (AMC)	Chen, JHC Jiang, L Deutsch, A Angyal, MS Spooner, TA	2009	99
	Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer Proceeding/Conference:Proceedings - Electronic Components and Technology Conference	Morsey, JD Jiang, L Rubin, BJ Deutsch, A Surovic, CW Becker, D Haridass, A	2008	109
	Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging	Hesford, AJ Morsey, JD Chew, WC Deutsch, A Smith, HH	2007	46
	Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP	Jiang, L Kolluri, S Rubin, BJ Smith, H Colgan, EG Scheuermann, MR Wakit, JA Deutsch, A Gill, J	2008	114
	A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging	Jiang, L Xu, C Rubin, BJ Weger, AJ Deutsch, A Smith, H Caron, A Banerjee, K	2010	153
	The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM Proceeding/Conference:IEEE Transactions on Advanced Packaging	Morsey, J Deutsch, A Libous, JP Surovic, C Rubin, BJ Jiang, L Eisenberg, L	2007	105
	The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging	Morsey, J Deutsch, A Libous, JP Surovic, C Rubin, BJ Jiang, L Eisenberg, L	2005	109

Showing results 5 to 11 of 11 < previous