Showing results 1 to 3 of 3
Title | Author(s) | Issue Date | Views | |
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Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints Journal:Journal of the Electrochemical Society | 2021 | 7 | ||
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints Journal:Microelectronics Reliability | 2019 | 60 | ||
2019 | 55 |