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Title | Author(s) | Issue Date | |
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TDDB Reliability Improvement of Cu Damascene with a Bilayer-Structured α-SiC:H Dielectric Barrier Journal:Journal of the Electrochemical Society | 2004 |
Title | Author(s) | Issue Date | |
---|---|---|---|
TDDB Reliability Improvement of Cu Damascene with a Bilayer-Structured α-SiC:H Dielectric Barrier Journal:Journal of the Electrochemical Society | 2004 |