| | Title | Author(s) | Year | View Count | | 1 |  | Thermal percolation in stable graphite suspensions | Zheng, R; Gao, J; Wang, JJ; Feng, SP; Ohtani, H; Wang, JB; Chen, G | 2012 | 137 |
| 2 | | High-performance flat-panel solar thermoelectric generators with high thermal concentration | Kraemer, D; Poudel, B; Feng, HP; Caylor, JC; Yu, B; Yan, X; Ma, Y; Wang, X; Wang, D; Muto, A; McEnaney, K; Chiesa, M; Ren, Z; Chen, G | 2011 | 235 |
| 3 | | Studies on surface preparation and smoothness of nanostructured Bi 2Te 3-based alloys by electrochemical and mechanical methods | Feng, HP; Yu, B; Chen, S; Collins, K; He, C; Ren, ZF; Chen, G | 2011 | 152 |
| 4 | | Nanoparticle-enabled selective electrodeposition | Feng, HP; Paudel, T; Yu, B; Chen, S; Ren, ZF; Chen, G | 2011 | 153 |
| 5 | | The simple and easy way to manufacture counter electrode for dye-sensitized solar cells | Lan, JL; Wang, YY; Wan, CC; Wei, TC; Feng, HP; Peng, C; Cheng, HP; Chang, YH; Hsu, WC | 2010 | 172 |
| 6 | | Platinum nanoparticles on flexible carbon fiber paper without transparent conducting oxide glass as counter electrode for dye-sensitized solar cells | Lan, JL; Feng, HP; Wei, TC; Peng, C; Cheng, HP; Chen, WH; Chang, YH; Hsu, WC; Wan, CC | 2010 | 162 |
| 7 | | Effect of impurity and illumination on copper oxidation after chemical mechanical polishing | Feng, HP; Lin, JY; Wang, YY; Wan, CC | 2008 | 160 |
| 8 | | Behavior of copper removal by CMP and its correlation to deposit structure and impurity content | Feng, HP; Lin, JY; Cheng, MY; Wang, YY; Wan, CC | 2008 | 155 |
| 9 | | Void defect reduction after chemical mechanical planarization of trenches filled by direct/pulse plating | Lin, JY; Wan, CC; Wang, YY; Feng, HP | 2007 | 144 |
| 10 | | Impurities induced localized corrosion between copper and tantalum nitride during chemical mechanical planarization | Lin, JY; Wang, YY; Wan, CC; Feng, HP; Cheng, MY | 2007 | 141 |
| 11 | | Effect of plating current density and annealing on impurities in electroplated Cu film | Liu, CW; Wang, YL; Tsai, MS; Feng, HP; Chang, SC; Hwang, GJ | 2005 | 121 |
| 12 | | Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activation | Fong, HP; Wu, Y; Wang, YY; Wan, CC | 2003 | 113 |
| 13 | | Displacement reactions between metal ions and nitride barrier layer/silicon substrate | Wu, Y; Chen, WC; Fong, HP; Wan, CC; Wang, YY | 2002 | 164 |
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