Conf. Papers & Presentations (Feng, SPT)
Results 1-4 of 4.
|1||Thermoelectric energy conversion using nanostructured materials||Chen, G; Kraemer, D; Muto, A; McEnaney, K; Feng, HP; Liu, WS; Zhang, Q; Yu, B; Ren, Z||2011||179|
|2||Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing||Cheng, MY; Chen, KW; Liu, TF; Wang, YL; Feng, HP||2010||174|
|3||Investigation of the behaviors of various electroplated copper films during CMP||Feng, HP; Cheng, MY; Wang, YY; Wan, CC||2006||156|
|4||Mechanism for Cu void defect on various electroplated film conditions||Feng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC||2006||240|