File Download
There are no files associated with this item.
Links for fulltext
(May Require Subscription)
- Publisher Website: 10.1143/JJAP.43.7415
- Scopus: eid_2-s2.0-11144230022
- WOS: WOS:000225582000010
- Find via
Supplementary
- Citations:
- Appears in Collections:
Article: Effects of O2 - And N2 -plasma treatments on copper surface
Title | Effects of O<inf>2</inf>- And N<inf>2</inf>-plasma treatments on copper surface |
---|---|
Authors | |
Keywords | Dielectric breakdown Cu-O Copper surface Plasma treatment Cu-N |
Issue Date | 2004 |
Citation | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2004, v. 43, n. 11 A, p. 7415-7418 How to Cite? |
Abstract | In this work, we investigate the effects of oxygen (O ) and nitrogen (N ) plasma treatments on the copper surface of aluminum/amorphous silicon-nitricarbide/copper (Al/α-SiCN/Cu) metal-insulator-metal (MIM) capacitors with respect to their leakage current and breakdown field. It is found that both the O - and N -plasma treatments have an adverse effect on the leakage current and breakdown field of MIM capacitors. The MIM capacitors with their Cu surfaces subjected to O - or N -plasma treatment exhibit a room-temperature leakage current density several orders of magnitude larger than that of the sample without plasma treatment at the same applied electric field. The room-temperature breakdown fields of the MIM capacitors with O - and N -plasma-treated Cu surfaces are 3.8 and 3.2MV/cm, respectively, while that of the control sample without plasma treatment is 7.8MV/cm. The increased leakage currents and degraded breakdown fields of the O - and N -plasma-treated samples are attributed, respectively, to the presence of metastable Cu-O oxide and Cu-N azide at the Cu surfaces. 2 2 2 2 2 2 2 2 2 2 |
Persistent Identifier | http://hdl.handle.net/10722/298005 |
ISSN | 2021 Impact Factor: 1.491 2020 SCImago Journal Rankings: 0.487 |
ISI Accession Number ID |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chiang, Chiu Chih | - |
dc.contributor.author | Chen, Mao Chieh | - |
dc.contributor.author | Li, Lain Jong | - |
dc.contributor.author | Wu, Zhen Cheng | - |
dc.contributor.author | Jang, Syun Ming | - |
dc.contributor.author | Liang, Mong Song | - |
dc.date.accessioned | 2021-04-08T03:07:27Z | - |
dc.date.available | 2021-04-08T03:07:27Z | - |
dc.date.issued | 2004 | - |
dc.identifier.citation | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2004, v. 43, n. 11 A, p. 7415-7418 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | http://hdl.handle.net/10722/298005 | - |
dc.description.abstract | In this work, we investigate the effects of oxygen (O ) and nitrogen (N ) plasma treatments on the copper surface of aluminum/amorphous silicon-nitricarbide/copper (Al/α-SiCN/Cu) metal-insulator-metal (MIM) capacitors with respect to their leakage current and breakdown field. It is found that both the O - and N -plasma treatments have an adverse effect on the leakage current and breakdown field of MIM capacitors. The MIM capacitors with their Cu surfaces subjected to O - or N -plasma treatment exhibit a room-temperature leakage current density several orders of magnitude larger than that of the sample without plasma treatment at the same applied electric field. The room-temperature breakdown fields of the MIM capacitors with O - and N -plasma-treated Cu surfaces are 3.8 and 3.2MV/cm, respectively, while that of the control sample without plasma treatment is 7.8MV/cm. The increased leakage currents and degraded breakdown fields of the O - and N -plasma-treated samples are attributed, respectively, to the presence of metastable Cu-O oxide and Cu-N azide at the Cu surfaces. 2 2 2 2 2 2 2 2 2 2 | - |
dc.language | eng | - |
dc.relation.ispartof | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | - |
dc.subject | Dielectric breakdown | - |
dc.subject | Cu-O | - |
dc.subject | Copper surface | - |
dc.subject | Plasma treatment | - |
dc.subject | Cu-N | - |
dc.title | Effects of O<inf>2</inf>- And N<inf>2</inf>-plasma treatments on copper surface | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1143/JJAP.43.7415 | - |
dc.identifier.scopus | eid_2-s2.0-11144230022 | - |
dc.identifier.volume | 43 | - |
dc.identifier.issue | 11 A | - |
dc.identifier.spage | 7415 | - |
dc.identifier.epage | 7418 | - |
dc.identifier.isi | WOS:000225582000010 | - |
dc.identifier.issnl | 0021-4922 | - |