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Conference Paper: Entropy Analysis In Heat Conduction

TitleEntropy Analysis In Heat Conduction
Authors
Tian, XWang, L
Issue Date2019
Citation
607th International Academic Conference on Engineering, Technology and Innovations (IACETI) How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/274139

 

DC FieldValueLanguage
dc.contributor.authorTian, X-
dc.contributor.authorWang, L-
dc.date.accessioned2019-08-18T14:55:51Z-
dc.date.available2019-08-18T14:55:51Z-
dc.date.issued2019-
dc.identifier.citation607th International Academic Conference on Engineering, Technology and Innovations (IACETI)-
dc.identifier.urihttp://hdl.handle.net/10722/274139-
dc.languageeng-
dc.relation.ispartof607th International Academic Conference on Engineering, Technology and Innovations (IACETI)-
dc.titleEntropy Analysis In Heat Conduction-
dc.typeConference_Paper-
dc.identifier.emailTian, X: tianxw@hku.hk-
dc.identifier.emailWang, L: lqwang@hku.hk-
dc.identifier.authorityWang, L=rp00184-
dc.identifier.hkuros302070-

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