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Conference Paper: Fabrication and characterization of Si nanotip arrays for Si-based nano-devices

TitleFabrication and characterization of Si nanotip arrays for Si-based nano-devices
Authors
KeywordsSilicon nanotip
Isotropic etching
Electron beam lithography
Issue Date2008
PublisherSPIE - International Society for Optical Engineering. The Journal's web site is located at https://www.spiedigitallibrary.org/conference-proceedings-of-spie
Citation
Proceedings of SPIE - The International Society for Optical Engineering, 2008, v. 6984 How to Cite?
AbstractA simple and efficient technique for fabricating two-dimensional arrays of silicon nanotips by using electron beam lithography (EBL) and reactive ion etching (RIE) was reported. For the RIE processes, two kind of reactive gases, CHF3 and SF6, were used as plasma etching source for Si. The experiment results indicate that the reactive ion etching mechanism is different: the isotropic process for SF6 and anisotropic for CHF 3. It is found that the mixed O2/SF6 plasma etching can improve the properties of profile and surface of Si nanotips. Under the condition of ratio ~15%, the 10 nm top size of Si nanotips was obtained.
Persistent Identifierhttp://hdl.handle.net/10722/265535
ISSN
2020 SCImago Journal Rankings: 0.192

 

DC FieldValueLanguage
dc.contributor.authorZhang, Xiangao-
dc.contributor.authorLiu, Kui-
dc.contributor.authorChen, Kunji-
dc.contributor.authorXu, Jun-
dc.contributor.authorMa, Zhongyuan-
dc.contributor.authorLi, Wei-
dc.contributor.authorXu, Ling-
dc.contributor.authorHuang, Xinfan-
dc.date.accessioned2018-12-03T01:20:57Z-
dc.date.available2018-12-03T01:20:57Z-
dc.date.issued2008-
dc.identifier.citationProceedings of SPIE - The International Society for Optical Engineering, 2008, v. 6984-
dc.identifier.issn0277-786X-
dc.identifier.urihttp://hdl.handle.net/10722/265535-
dc.description.abstractA simple and efficient technique for fabricating two-dimensional arrays of silicon nanotips by using electron beam lithography (EBL) and reactive ion etching (RIE) was reported. For the RIE processes, two kind of reactive gases, CHF3 and SF6, were used as plasma etching source for Si. The experiment results indicate that the reactive ion etching mechanism is different: the isotropic process for SF6 and anisotropic for CHF 3. It is found that the mixed O2/SF6 plasma etching can improve the properties of profile and surface of Si nanotips. Under the condition of ratio ~15%, the 10 nm top size of Si nanotips was obtained.-
dc.languageeng-
dc.publisherSPIE - International Society for Optical Engineering. The Journal's web site is located at https://www.spiedigitallibrary.org/conference-proceedings-of-spie-
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineering-
dc.subjectSilicon nanotip-
dc.subjectIsotropic etching-
dc.subjectElectron beam lithography-
dc.titleFabrication and characterization of Si nanotip arrays for Si-based nano-devices-
dc.typeConference_Paper-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1117/12.792018-
dc.identifier.scopuseid_2-s2.0-42149176230-
dc.identifier.volume6984-
dc.identifier.spagenull-
dc.identifier.epagenull-
dc.identifier.issnl0277-786X-

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