File Download

Conference Paper: A new tightly-coupled transient electro-thermal simulation method for power electronics

TitleA new tightly-coupled transient electro-thermal simulation method for power electronics
Authors
Issue Date2016
PublisherIEEE.
Citation
The 2016 International Conference On Computer Aided Design (ICCAD), Austin, TX., 7-10 November 2016. In Conference Proceedings, 2016, p. 1-6 How to Cite?
AbstractThis paper presents a new transient electro-thermal (ET) simulation method for fast 3D chip-level analysis of power electronics with field solver accuracy. The metallization stacks are meshed and solved with 3D field solver using nonlinear temperature-dependent parameters, and the active devices are modeled with nonlinear tabular compact models to avoid time-consuming TCAD simulation. The main contributions include: 1) A tightly-coupled formulation that solves the electrical and thermal responses simultaneously for better convergence property; 2) Explicit account of capacitive effects, including interconnect parasitic capacitance and gate capacitance of power devices, to improve modeling accuracy in highfrequency applications; 3) A specialized transient solver based on the matrix exponential method (MEXP) to address the multi-scale problem caused by the considerably different time scales in electrical and thermal dynamics. Numerical experiments have demonstrated the advantages of the proposed co-simulation framework.
DescriptionPaper no. 224
Persistent Identifierhttp://hdl.handle.net/10722/232359

 

DC FieldValueLanguage
dc.contributor.authorChen, Q-
dc.contributor.authorSchoenmaker, W-
dc.date.accessioned2016-09-20T05:29:27Z-
dc.date.available2016-09-20T05:29:27Z-
dc.date.issued2016-
dc.identifier.citationThe 2016 International Conference On Computer Aided Design (ICCAD), Austin, TX., 7-10 November 2016. In Conference Proceedings, 2016, p. 1-6-
dc.identifier.urihttp://hdl.handle.net/10722/232359-
dc.descriptionPaper no. 224-
dc.description.abstractThis paper presents a new transient electro-thermal (ET) simulation method for fast 3D chip-level analysis of power electronics with field solver accuracy. The metallization stacks are meshed and solved with 3D field solver using nonlinear temperature-dependent parameters, and the active devices are modeled with nonlinear tabular compact models to avoid time-consuming TCAD simulation. The main contributions include: 1) A tightly-coupled formulation that solves the electrical and thermal responses simultaneously for better convergence property; 2) Explicit account of capacitive effects, including interconnect parasitic capacitance and gate capacitance of power devices, to improve modeling accuracy in highfrequency applications; 3) A specialized transient solver based on the matrix exponential method (MEXP) to address the multi-scale problem caused by the considerably different time scales in electrical and thermal dynamics. Numerical experiments have demonstrated the advantages of the proposed co-simulation framework.-
dc.languageeng-
dc.publisherIEEE.-
dc.relation.ispartofInternational Conference On Computer Aided Design, ICCAD 2016 Proceedings-
dc.rightsInternational Conference On Computer Aided Design, ICCAD 2016 Proceedings. Copyright © IEEE.-
dc.rights©20xx IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.-
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.titleA new tightly-coupled transient electro-thermal simulation method for power electronics-
dc.typeConference_Paper-
dc.identifier.emailChen, Q: q1chen@hku.hk-
dc.identifier.authorityChen, Q=rp01688-
dc.description.naturepostprint-
dc.identifier.hkuros266482-
dc.identifier.spage1-
dc.identifier.epage6-
dc.publisher.placeUnited States-
dc.customcontrol.immutablesml 161004-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats