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Book Chapter: Statistical Study of Bias Temperature Instabilities by Means of 3D 'Atomistic' Simulation

TitleStatistical Study of Bias Temperature Instabilities by Means of 3D 'Atomistic' Simulation
Authors
Issue Date2013
PublisherSpringer
Citation
Statistical Study of Bias Temperature Instabilities by Means of 3D 'Atomistic' Simulation. In Grasser, T (Ed.), Bias Temperature Instability for Devices and Circuits, p. 323-348. New York: Springer, 2013 How to Cite?
AbstractThis chapter presents a comprehensive simulation study of the reliability performance in contemporary bulk MOSFET devices. With the CMOS technology entering in the nanoscale era, the statistical variability due to random dopant fluctuations plays a critical role in determining the transistor reliability performance. As a consequence, in contemporary devices, reliability and variability cannot be considered anymore as separate concepts. The reliability has to be reinterpreted as a time-dependent form of variability. In the first part of this chapter we introduce computational models and methods for modelling the reliability phenomena in presence of statistical variability. In particular we present both a frozen-time and a dynamical approach, showing details of their implementation and verification. In the second part of the chapter we report a broad set of simulation results highlighting the importance of variability in reliability evaluation of nanoscale devices. In particular we analyse the impact of variability on the single transistor and on many different transistors in presence of a single trapped charge. Then we show the effects related to multiple trapped charges. Finally the statistical results obtained using the frozen-time and the dynamical methods are compared in terms of accuracy in predicting the statistical dispersion in threshold voltage shifts
Persistent Identifierhttp://hdl.handle.net/10722/202028
ISBN

 

DC FieldValueLanguage
dc.contributor.authorAmoroso, SMen_US
dc.contributor.authorGerer, Len_US
dc.contributor.authorAdamu-Lema, Fen_US
dc.contributor.authorMarkov, SNen_US
dc.contributor.authorAsenov, Aen_US
dc.date.accessioned2014-08-21T07:58:38Z-
dc.date.available2014-08-21T07:58:38Z-
dc.date.issued2013en_US
dc.identifier.citationStatistical Study of Bias Temperature Instabilities by Means of 3D 'Atomistic' Simulation. In Grasser, T (Ed.), Bias Temperature Instability for Devices and Circuits, p. 323-348. New York: Springer, 2013en_US
dc.identifier.isbn9781461479086en_US
dc.identifier.urihttp://hdl.handle.net/10722/202028-
dc.description.abstractThis chapter presents a comprehensive simulation study of the reliability performance in contemporary bulk MOSFET devices. With the CMOS technology entering in the nanoscale era, the statistical variability due to random dopant fluctuations plays a critical role in determining the transistor reliability performance. As a consequence, in contemporary devices, reliability and variability cannot be considered anymore as separate concepts. The reliability has to be reinterpreted as a time-dependent form of variability. In the first part of this chapter we introduce computational models and methods for modelling the reliability phenomena in presence of statistical variability. In particular we present both a frozen-time and a dynamical approach, showing details of their implementation and verification. In the second part of the chapter we report a broad set of simulation results highlighting the importance of variability in reliability evaluation of nanoscale devices. In particular we analyse the impact of variability on the single transistor and on many different transistors in presence of a single trapped charge. Then we show the effects related to multiple trapped charges. Finally the statistical results obtained using the frozen-time and the dynamical methods are compared in terms of accuracy in predicting the statistical dispersion in threshold voltage shiftsen_US
dc.languageengen_US
dc.publisherSpringeren_US
dc.relation.ispartofBias Temperature Instability for Devices and Circuitsen_US
dc.titleStatistical Study of Bias Temperature Instabilities by Means of 3D 'Atomistic' Simulationen_US
dc.typeBook_Chapteren_US
dc.identifier.emailMarkov, SN: figaro@hku.hken_US
dc.identifier.doi10.1007/978-1-4614-7909-3_13en_US
dc.identifier.scopuseid_2-s2.0-84904193863-
dc.identifier.hkuros234557en_US
dc.identifier.spage323en_US
dc.identifier.epage348en_US
dc.publisher.placeNew York-

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