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Conference Paper: Copper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials

TitleCopper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials
Authors
Shih, KTang, Y
Issue Date2013
PublisherInternational Waste Working Group (IWWG).
Citation
The 1st Symposium of International Waste Working Group - Asian Region Branch (IWWG-ARB), Sapporo, Japan, 18-21 March 2013. In the Proceedings of the 1st Symposium of International Waste Working Group - Asian Region Branch, 2013, p. article no. 8-5 How to Cite?
DescriptionSession 8: Thermal Treatment & Recycling
Persistent Identifierhttp://hdl.handle.net/10722/190270

 

DC FieldValueLanguage
dc.contributor.authorShih, Ken_US
dc.contributor.authorTang, Yen_US
dc.date.accessioned2013-09-17T15:16:59Z-
dc.date.available2013-09-17T15:16:59Z-
dc.date.issued2013en_US
dc.identifier.citationThe 1st Symposium of International Waste Working Group - Asian Region Branch (IWWG-ARB), Sapporo, Japan, 18-21 March 2013. In the Proceedings of the 1st Symposium of International Waste Working Group - Asian Region Branch, 2013, p. article no. 8-5en_US
dc.identifier.urihttp://hdl.handle.net/10722/190270-
dc.descriptionSession 8: Thermal Treatment & Recycling-
dc.languageengen_US
dc.publisherInternational Waste Working Group (IWWG).-
dc.relation.ispartofProceedings of the 1st Symposium of International Waste Working Group - Asian Region Branch (IWWG-ARB)en_US
dc.titleCopper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materialsen_US
dc.typeConference_Paperen_US
dc.identifier.emailShih, K: kshih@hkucc.hku.hken_US
dc.identifier.emailTang, Y: tangyuan@hku.hken_US
dc.identifier.authorityShih, K=rp00167en_US
dc.description.naturepublished_or_final_version-
dc.identifier.hkuros222645en_US

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