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Article: A DMAIC approach to printed circuit board quality improvement

TitleA DMAIC approach to printed circuit board quality improvement
Authors
KeywordsDefine-Measure-Analyse-Improve Control (Dmaic) Approach
Design Of Experiment (Doe)
Multi-Layer Printed Circuit Board (Pcb)
Screening Process
Six Sigma Improvement
Surface Mount Technology (Smt)
Issue Date2004
PublisherSpringer U K. The Journal's web site is located at http://www.springer.com/engineering/production+eng/journal/170
Citation
International Journal Of Advanced Manufacturing Technology, 2004, v. 23 n. 7-8, p. 523-531 How to Cite?
AbstractSince the early 1990s, six sigma has been sweeping the business world, driving greater manufacturing and service quality than has ever been seen before. Statistical quality techniques are one of the decisive factors contributing to the success of the six-sigma implementation. Applying statistical quality techniques is especially important in the manufacture of surface-mounted printed circuit boards (PCB). As any defect in the solder joint can lead to circuit failure, the screening process is regarded as the most critical process in PCB manufacturing. According to the current process capability study of a PCB company, the capability of the screening process is under 1.33 - the company requirement. That is to say, the current printing process cannot reach a four-sigma level. Therefore, the objective of this study is to improve the sigma level of the screening process through the define-measure-analyse-improve-control (DMAIC) approach. At the early stages, process capability analysis (PCA) and statistical process control (SPC) were used to measure and analyse the current printing performance of the screening machines. During later stages, design of experiment (DOE) was conducted to determine the optimal settings of the critical-to-quality factors in the screening process. By using these optimal settings, six-sigma performance can be achieved.
Persistent Identifierhttp://hdl.handle.net/10722/177949
ISSN
2015 Impact Factor: 1.568
2015 SCImago Journal Rankings: 0.915
References

 

DC FieldValueLanguage
dc.contributor.authorTong, JPCen_US
dc.contributor.authorTsung, Fen_US
dc.contributor.authorYen, BPCen_US
dc.date.accessioned2012-12-19T09:40:57Z-
dc.date.available2012-12-19T09:40:57Z-
dc.date.issued2004en_US
dc.identifier.citationInternational Journal Of Advanced Manufacturing Technology, 2004, v. 23 n. 7-8, p. 523-531en_US
dc.identifier.issn0268-3768en_US
dc.identifier.urihttp://hdl.handle.net/10722/177949-
dc.description.abstractSince the early 1990s, six sigma has been sweeping the business world, driving greater manufacturing and service quality than has ever been seen before. Statistical quality techniques are one of the decisive factors contributing to the success of the six-sigma implementation. Applying statistical quality techniques is especially important in the manufacture of surface-mounted printed circuit boards (PCB). As any defect in the solder joint can lead to circuit failure, the screening process is regarded as the most critical process in PCB manufacturing. According to the current process capability study of a PCB company, the capability of the screening process is under 1.33 - the company requirement. That is to say, the current printing process cannot reach a four-sigma level. Therefore, the objective of this study is to improve the sigma level of the screening process through the define-measure-analyse-improve-control (DMAIC) approach. At the early stages, process capability analysis (PCA) and statistical process control (SPC) were used to measure and analyse the current printing performance of the screening machines. During later stages, design of experiment (DOE) was conducted to determine the optimal settings of the critical-to-quality factors in the screening process. By using these optimal settings, six-sigma performance can be achieved.en_US
dc.languageengen_US
dc.publisherSpringer U K. The Journal's web site is located at http://www.springer.com/engineering/production+eng/journal/170en_US
dc.relation.ispartofInternational Journal of Advanced Manufacturing Technologyen_US
dc.subjectDefine-Measure-Analyse-Improve Control (Dmaic) Approachen_US
dc.subjectDesign Of Experiment (Doe)en_US
dc.subjectMulti-Layer Printed Circuit Board (Pcb)en_US
dc.subjectScreening Processen_US
dc.subjectSix Sigma Improvementen_US
dc.subjectSurface Mount Technology (Smt)en_US
dc.titleA DMAIC approach to printed circuit board quality improvementen_US
dc.typeArticleen_US
dc.identifier.emailYen, BPC: benyen@hkucc.hku.hken_US
dc.identifier.authorityYen, BPC=rp01121en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1007/s00170-003-1721-z-
dc.identifier.scopuseid_2-s2.0-2442451658en_US
dc.identifier.hkuros94785-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-2442451658&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume23en_US
dc.identifier.issue7-8en_US
dc.identifier.spage523en_US
dc.identifier.epage531en_US
dc.publisher.placeUnited Kingdomen_US
dc.identifier.scopusauthoridTong, JPC=7202724330en_US
dc.identifier.scopusauthoridTsung, F=7003719356en_US
dc.identifier.scopusauthoridYen, BPC=7102564239en_US

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